Progress in Directed Self-Assembly hole shrink applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8682, Issue , 2013, Pages

  Younkin, Todd R ^a,b   Gronheid, Roel ^b   Rincon Delgadillo, Paulina ^b,c   Chan, Boon Teik ^b   Vandenbroeck, Nadia ^b   Demuynck, Steven ^b   Romo Negreira, Ainhoa ^b,d   Parnell, Doni ^b,d   Nafus, Kathleen ^b,d   Tahara, Shigeru ^b,e   Somervell, Mark ^f  

^a INTEL CORPORATION   (United States)

^b IMEC   (Belgium)

^c UNIVERSITY OF CHICAGO   (United States)

^d Tokyo Electron Europe Limited   (United Kingdom)

^e Tokyo Electron Miyagi Ltd   (Japan)

^f TOKYO ELECTRON AMERICA INC   (United States)

Author keywords

BCP; Blend; Block copolymer; Contact hole; Directed Self Assembly; DSA; PS b PMMA; Shrink

Indexed keywords

BCP; BLEND; CONTACT HOLES; DIRECTED SELF-ASSEMBLY; DSA; PS-B-PMMA; SHRINK;

BLOCK COPOLYMERS; TESTING;

SELF ASSEMBLY;

EID: 84878387419     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.2012353     Document Type: Conference Paper

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