Fabrication of copper/modal fabric composites through electroless plating process for electromagnetic interference shielding

Materials Chemistry and Physics

Volumn 140, Issue 2-3, 2013, Pages 553-558

  Lu, Yinxiang ^a   Liang, Qian ^a   Li, Wenlong ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Coatings; Composite materials; Electrical properties; Mechanical testing

Indexed keywords

3-AMINOPROPYLTRIMETHOXYSILANE; CONDUCTIVE FABRICS; ELECTRICAL CONDUCTIVITY; ELECTROLESS COPPER DEPOSITION; ELECTROLESS PLATING PROCESS; ELECTROMAGNETIC INTERFERENCE SHIELDING; ELECTROMAGNETIC INTERFERENCE SHIELDING EFFECTIVENESS; SILVER-ACTIVATION;

CHEMICAL ACTIVATION; COATINGS; COMPOSITE MATERIALS; COPPER PLATING; ELECTRIC CONDUCTIVITY; ELECTRIC PROPERTIES; ELECTROLESS PLATING; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC WAVE INTERFERENCE; MECHANICAL TESTING; METAL COATINGS; SIGNAL INTERFERENCE; SILVER;

GRAFTING (CHEMICAL);

EID: 84878304364     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2013.03.068     Document Type: Article

References (25)

1. A.D. Gun Fiber. Polym. 12 2011 258
2. A. Riva, I. Algaba, and M. Pepio Fiber. Polym. 8 2007 205
3. J.H. Byeon, and J.W. Kim Thin Solid Films 520 2011 1048
4. C.H. Huang, J.H. Lin, R.B. Yang, C.W. Lin, and C.W. Lou J. Electron. Mater. 41 2012 2267
5. Y.W. Sui, Z. Sun, X.H. Wang, and Y.J. Ren Mater. Sci. Tech. 27 2011 1680
6. P. Pawlak, E. Korzeniewska, M. Frydrysiak, J. Zieba, L. Tesiorowski, K. Gniotek, Z. Stempien, and M. Tokarska Fibres Text. East. Eur. 20 2012 68
7. H.J. Yang, and H.Y. Tuan J. Mater. Chem. 22 2012 2215
8. S. Shahidi, M. Ghoranneviss, B. Moazzenchi, A. Rashidi, and M. Mirjalili Plasma Process. Polym. 4 2007 S1098
9. L.L. Li, D. Yu, L. Wang, and W. Wang J. Appl. Polym. Sci. 124 2012 1912
10. V.I. Varentsova, V.K. Varenstov, I.A. Bataev, and S.I. Yusin Prot. Met. Phys. Chem. 47 2011 43
11. E.G. Han, E.A. Kim, and K.W. Oh Synth. Met. 123 2001 469
12. A. Varesano, B. Antognozzi, and C. Tonin Synth. Met. 160 2010 1683
13. L.J. Wang, L.L. Sun, and J. Li Bioresources 6 2011 3493 3504
14. N. Li Practical Technology for Electroless Plating 2004 Chemical Industry Press Beijing, China 267
15. M.J. John, and S. Thomas Carbohydr. Polym. 71 2008 343
16. F.W. Langkilde, and A. Svantesson J. Pharmaceut. Biomed. 13 1995 409
17. A. Synytsya, J. Copikova, P. Matejka, and V. Machovic Carbohydr. Polym. 54 2003 97
18. R. Mitchell, C. Carr, M. Parfitt, J. Vickerman, and C. Jones Cellulose 12 2005 629
19. M. Furutani, and K. Kudo J. Mater. Chem. 22 2012 3139
20. R.H. Guo, S.Q. Jiang, C.W.M. Yuen, and M.C.F. Ng J. Mater. Sci. Mater. Electron. 20 2009 33
21. B.E. Warren X-ray Diffraction 1990 Dover New York
22. X.Y. Cui, D.A. Hutt, and P.P. Conway Thin Solid Films 520 2012 6095
23. G.X. Wang, N. Li, H.L. Hu, and Y.C. Yu Appl. Surf. Sci. 253 2006 480
24. European Parliament and the Council, 2005/90/EC, 2006.
25. A. Garcia, T. Berthelot, P. Viel, A. Mesnage, P. Jegou, F. Nekelson, S. Roussel, and S. Palacin ACS Appl. Mater. Interfaces 2 2010 1177