Microstructure and friction performance of copper film fabricated by ion implantation assisted electroless plating on PTFE

Materials Science and Technology

Volumn 27, Issue 11, 2011, Pages 1680-1685

  Sui, Y W ^a   Sun, Z ^a   Wang, X H ^a   Ren, Y J ^a  

^a CHINA UNIVERSITY OF MINING AND TECHNOLOGY   (China)

Author keywords

Electroless copper plating; Friction; Ion implantation; Microstructure; Polytetrafluoroethylene

Indexed keywords

ANNEALING TREATMENTS; CAMPBELL; COMPREHENSIVE PROPERTIES; COPPER FILMS; ELECTROLESS COPPER PLATING; FRICTION AND WEAR; FRICTION COEFFICIENTS; FRICTION PERFORMANCE; METALLIC STRUCTURES; PREPRESSING; SURFACE PRETREATMENT; TEST CONDITION; WEAR RATES;

COPPER PLATING; ELECTROLESS PLATING; FRICTION; ION IMPLANTATION; IONS; METALLIC FILMS; MICROSTRUCTURE; POLYTETRAFLUOROETHYLENES; TRIBOLOGY; X RAY DIFFRACTION;

COPPER;

EID: 80054977383     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/1743284710Y.0000000027     Document Type: Article

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