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Volumn 520, Issue 3, 2011, Pages 1048-1052

Aerosol based fabrication of a Cu/polymer and its application for electromagnetic interference shielding

Author keywords

Copper; Electroless deposition; Electromagnetic interference shielding; Nanoparticles; Paladium; Polymer substrates; Surface activation

Indexed keywords

AEROSOL NANOPARTICLE; CATALYTIC SURFACES; ELECTROMAGNETIC INTERFERENCE SHIELDING; GHZ FREQUENCIES; GRAIN SIZE; PALADIUM; POLYMER SUBSTRATE; POLYMER SUBSTRATES; SHIELDING EFFECTIVENESS; SURFACE ACTIVATION; WET CHEMICAL PROCESS;

ATMOSPHERIC AEROSOLS; CHEMICAL ACTIVATION; CHLORINE; COPPER; COPPER DEPOSITS; ELECTROLESS PLATING; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTROMAGNETISM; NANOPARTICLES; PALLADIUM; POLYMERS; SHIELDING; SIGNAL INTERFERENCE; SUBSTRATES; TIN;

ELECTROMAGNETIC SHIELDING;

EID: 81855206323 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2011.08.064 Document Type: Conference Paper

Times cited : (28)

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