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Thin Solid Films

Volumn 537, Issue , 2013, Pages 108-112

Thermal conductivity of titanium aluminum silicon nitride coatings deposited by lateral rotating cathode arc

(7) Samani, M K a,b,d Ding, X Z b Amini, S c Khosravian, N a Cheong, J Y a Chen, G e Tay, B K a,d

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

c NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

d RESEARCH TECHNO PLAZA (Singapore)

e BC Photonics Technological Co (Canada)

Author keywords

Physical vapour deposition; Pulsed photothermal reflectance; Thermal conductivity; Titanium aluminum silicon nitride

Indexed keywords

CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES; ENERGY DISPERSIVE X RAY SPECTROSCOPY; PHYSICAL VAPOUR DEPOSITION; PREFERENTIAL ORIENTATION; PULSED PHOTOTHERMAL REFLECTANCE; REDUCTION OF THERMAL CONDUCTIVITY; STAINLESS STEEL SUBSTRATES; TITANIUM ALUMINUM SILICON NITRIDE;

ALUMINUM; CATHODES; COATINGS; DEPOSITS; GRAIN BOUNDARIES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING GALLIUM COMPOUNDS; SILICON; SILICON NITRIDE; THERMAL CONDUCTIVITY; TITANIUM; TITANIUM NITRIDE; VAPORS; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

ALUMINUM COATINGS;

EID: 84878281432 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2013.04.029 Document Type: Article

Times cited : (22)

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