Improvement in the etching performance of the acrylonitrile-butadiene- styrene resin by MnO2-H3PO4-H 2SO4 colloid

Langmuir

Volumn 29, Issue 20, 2013, Pages 5968-5973

  Zhao, Wenxia ^a   Ding, Jie ^a   Wang, Zenglin ^a  

^a SHAANXI NORMAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACRYLONITRILE-BUTADIENE-STYRENE; COMPLEXING AGENTS; ELECTROLESS COPPER; ETCHING CONDITION; ETCHING PERFORMANCE; ION CONCENTRATIONS; OXIDATION POTENTIALS; OXIDATION REACTIONS;

ADHESION; BOND STRENGTH (MATERIALS); BUTADIENE; COLLOIDS; ETCHING; MANGANESE; MANGANESE OXIDE; POLYBUTADIENES; RESINS; STYRENE; SURFACE CHEMISTRY; SURFACE ROUGHNESS;

ABS RESINS;

1,3 BUTADIENE; 1,3 BUTADIENE DERIVATIVE; 1,3-BUTADIENE; ACRYLONITRILE; MANGANESE DERIVATIVE; MANGANESE DIOXIDE; OXIDE; PHOSPHORIC ACID; POLYMER; STYRENE; SULFURIC ACID;

ARTICLE; CHEMISTRY; COLLOID; PARTICLE SIZE; SURFACE PROPERTY;

ACRYLONITRILE; BUTADIENES; COLLOIDS; MANGANESE COMPOUNDS; OXIDES; PARTICLE SIZE; PHOSPHORIC ACIDS; POLYMERS; STYRENE; SULFURIC ACIDS; SURFACE PROPERTIES;

EID: 84878264611     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la400321k     Document Type: Article

References (17)

1. Dos Santos Ferreira, O.; Stevens, A.; Schrauwen, C. Quantitative Comparison of Adhesion in Metal-to-Plastic Systems Thin Solid Films 2009, 517, 3070-3074
2. McCaskie, J. E. A Survey of Mechanisms for Adhering Metal Films to Plastic Surfaces Plating on Plastics 2006, 5, 31-39
3. 2 under UV Light Irradiation J. Surf. Finish. Soc. Jpn. 2006, 57, 162-166
4. 2 as a Photocatalyst J. Surf. Finish. Soc. Jpn. 2006, 57, 157-161
5. Kim, G. G.; Kang, J. A.; Kim, S. J.; Kim, S. J.; Shin, S. H. Improved Adhesion to ABS Plastics by a Photocatalytic Reaction Mater. Sci. Forum 2007, 544, 75-78
6. Bessho, T.; Yoshinaga, F.; Inoue, K.; Koiwa, I.; Honma, H. Pretreatment of Nickel Plating on ASA Resin Using Ozonated Water as Replacement for Chromic Acid Etching J. Surf. Finish. Soc. Jpn. 2006, 57, 659-663
7. Li, Z. X.; Li, N.; Yin, L.; He, Y.; Wang, Z. L. An Environment-Friendly Surface Pretreatment of ABS Resin Prior to Electroless Plating Electrochem. Solid-State Lett. 2009, 12, D92-D95
8. Wang, Z. L.; Li, Z. X.; He, Y.; Wang, Z. L. Study of an Environmentally Friendly Surface Etching System of ABS for Improving Adhesion of Electroless Cu film J. Electrochem. Soc. 2011, 158, D664-D670
9. 2 Colloid with Ultrasound-Assisted Treatment J. Adhesion Sci. Tech. 2011, 25, 1211-1221
10. 4 Colloid for Adhesion Improvement of Epoxy Polymer J. Adhesion Sci. Tech. 2012, 26, 1407-1417
11. Herszage, J.; Santos Afonso, M. Mechanism of Hydrogen Sulfide Oxidation by Manganese(IV) Oxide in Aqueous Solutions Langmuir 2003, 19, 9684-9692
12. Adcock, J. L.; Francis, P. S.; Barnett, N. W. Acidic Potassium Permanganate As a Chemiluminescence Reagent-A Review Anal. Chim. Acta 2007, 601, 36-67
13. Jiang, H. Y.; Liu, Z. J.; Wang, X. W.; Wang, Z. L. Effect of Triethanolamine on Deposition Rate of Electroless Copper Plating Trans. Inst. Met. Finish. 2007, 85, 103-106
14. Wang, Z. L.; Furaya, A.; Yasuda, K.; Ikeda, H.; Baba, T.; Hagiwara, M.; Toki, S.; Shigubara, S.; Kubota, H.; Ohmi, T. Adhesion Improvement of Electroless Copper to a Polyimide Film Substrate by Combining Surface Microroughening and Imide Ring Cleavage J. Adhes. Sci. Technol. 2002, 16, 1027-1040
15. Chastain, J. Handbook of X-ray Photoelectron Spectroscopy; Chastain, J., ed.; PerkinElmer Corporation, Physical Electronics Division: Eden Prairie, MN, 1992; p 182.
16. Siau, S.; Vervaet, A.; Nalines, S.; Schacht, E.; Calster, A. V. Kinetic Study of Wet Chemical Treatments on the Surface Roughness of Epoxy Polymer Layers for Buildup Layers J. Electrochem. Soc. 2004, 151, C831-C849
17. Siau, S.; Vervaet, A.; Vaeck, L. V.; Schacht, E.; Demeter, U.; Calster, A. V. Adhesion Strength of the Epoxy Polymer/Copper Interface for Use in Microelectronics J. Electrochem. Soc. 2005, 152, C442-C455