Study of an environmentally friendly surface etching system of ABS for improving adhesion of electroless Cu film

Journal of the Electrochemical Society

Volumn 158, Issue 11, 2011, Pages

  Wang, Zenglin ^a   Li, Zhixin ^a   He, Yue ^a   Wang, Zhixiang ^a  

^a SHAANXI NORMAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACRYLONITRILE-BUTADIENE-STYRENE; BATH TEMPERATURES; C-C BONDS; CHROMIC ACID; CU FILMS; ELECTRICAL POTENTIAL MEASUREMENTS; ELECTROLESS; ELECTROLESS COPPER; ENVIRONMENT FRIENDLY; ENVIRONMENTALLY FRIENDLY SYSTEMS; ENVIRONMENTALLY-FRIENDLY; ETCHING TIME; ETCHING TREATMENT; FT-IR SPECTRUM; OH GROUP; OXIDATION POTENTIALS; PCB PROCESS; SURFACE CONTACT ANGLE; SURFACE ETCHING; SURFACE HYDROPHILICITY;

ABS RESINS; ADHESION; BOND STRENGTH (MATERIALS); BUTADIENE; COLLOID CHEMISTRY; COLLOIDS; CONTACT ANGLE; COPPER; ELECTROLESS PLATING; HYDROPHILICITY; MANGANESE OXIDE; POLYCHLORINATED BIPHENYLS; STYRENE; SUBSTRATES; SURFACE ROUGHNESS;

ETCHING;

EID: 80054028169     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.063111jes     Document Type: Article

References (18)

1. O. D. Santos Ferreira, A. Stevens, and C. Schrauwen, Thin Solid Films, 517, 3070 (2009). 10.1016/j.tsf.2008.11.117
2. Li-zhi Di, Bin Liu, Jian-jing Song, Dan Shan, and De-an Yang, Appl. Surf. Sci., 257 (9), 4272 (2010). 10.1016/j.apsusc.2010.12.035
3. K. M. Shams, G. Tichy, A. Fischer, K. Filip, M. Sager, A. Bashar, T. Peer, and M. Jozic, Geophys. Res. Abstr., 10, A-05037 (2008).
4. L. A. C. Teixeira and M. C. Santini, J. Mater. Process Technol., 170, 37 (2005). 10.1016/j.jmatprotec.2005.04.075 (Pubitemid 41526149)
5. M. Sugimoto, K. Tashiro, T. Bessho, I. Koiwa, and H. Honma, J. Surf. Finish. Soc. Jap., 57 (2), 162 (2006). 10.4139/sfj.57.162
6. T. Bessho, K. Tashiro, K. Inoue, K. Ishikawa, I. Koiwa, and H. Honma, J. Surf. Finish. Soc. Jap., 57 (2), 157 (2006). 10.4139/sfj.57.157
7. G. G. Kim, J. A. Kang, S. J. Kim, S. J. Kim, and S. H. Shin, Mater. Sci. Forum, 544-545, 75 (2007). 10.4028/www.scientific.net/MSF.544-545.75
8. T. Bessho, F. Yoshinaga, K. Inoue, I. Koiwa, and H. Honma, J. Surf. Finish. Soc. Jap., 57 (9), 659 (2006). 10.4139/sfj.57.659
9. Z. Li, N. Li, L. Yin, Y. He, and Z. Wang, Electrochem. Solid-State Lett., 12 (12), D92 (2009). 10.1149/1.3231137
10. Z. Yang, Y. He, Z. Li, and N. Li, Z. Wang, J. Adhesion Sci. Tech., 25 (11), 1211 (2011). 10.1163/016942410X549915
11. H. Jiang, Z. Liu, X. Wang, and Z. Wang, Trans. Inst. Met. Finish., 85, 103 (2007). 10.1179/174591907X177543 (Pubitemid 46492481)
12. Z. Wang, A. Furaya, K. Yasuda, H. Ikeda, T. Baba, M. Hagiwara, S. Toki, S. Shigubara, H. Kubota, and T. Ohmi, J. Adhes. Sci. Technol., 16, 1027 (2002). 10.1163/156856102760146147 (Pubitemid 34725946)
13. Z. Wang, O. Yaegashi, H. Sakaue, S. Shingubara, and T. Takahagi, J. Appl. Phys., 94 (7), 4697 (2003). 10.1063/1.1609644
14. S. Siau, A. Vervaet, S. Nalines, E. Schacht, and A. Calster, J. Electrochem. Soc., 151 (12), C816 (2004). 10.1149/1.1813991 (Pubitemid 40006155)
15. S. Siau, A. Vervaet, S. Nalines, E. Schacht, and A. Calster, J. Electrochem. Soc., 151 (12), C831 (2004). 10.1149/1.1814011 (Pubitemid 40009254)
16. S. L. Brock, N. Duan, Z. Tian, O. Giraldo, H. Zhou, and S. Suib, Chem. Mater., 10, 2619 (1998). 10.1021/cm980227h
17. S. Siau, A. Vervaet, L. Vaeck, E. Schacht, U. Demeter, and A. Calster, J. Electrochem. Soc., 152 (6), C442 (2005). 10.1149/1.1904911 (Pubitemid 41013490)
18. J. Chastain: Handbook of X-ray Photoelectron Spectroscopy, ed., J. Chastain, (Perkin- Elmer Corporation, Physical Electronics Division, Eden Prairie, MN, 1992) p. 182.