Seamless integration of CMOS and microfluidics using flip chip bonding

Journal of Micromechanics and Microengineering

Volumn 23, Issue 3, 2013, Pages

  Welch, David ^a   Christen, Jennifer Blain ^a  

^a AZ 85281   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-AMINOPROPYLTRIETHOXYSILANE; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; ELECTRICAL INTERFACE; FLIP CHIP ATTACHMENT; MICROFLUIDIC CHANNEL; OXYGEN PLASMA TREATMENTS; PRINTED CIRCUIT BOARDS (PCB); SEAMLESS INTEGRATION;

CHEMICAL BONDS; MICROCHANNELS; MICROELECTRONICS; ORGANIC POLLUTANTS; PLASMA APPLICATIONS; POLYIMIDES; SILICONES;

MICROFLUIDICS;

EID: 84878128047     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/3/035009     Document Type: Article

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