General behavioral thermal modeling and characterization for multi-core microprocessor design

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2010, Pages 1136-1141

  Eguia, Thom J A ^a   Tan, Sheldon X D ^a   Shen, Ruijing ^a   Pacheco, Eduardo H ^b   Tirumala, Murli ^b  

^a University of California Riverside   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Architecture thermal modeling; Multicore processor; Thermal analysis

Indexed keywords

BEHAVIORAL RESEARCH; INTEGRATED CIRCUIT DESIGN; MARKOV PROCESSES; MATRIX ALGEBRA; THERMOANALYSIS;

MICROPROCESSOR DESIGNS; MITIGATION TECHNIQUES; MULTI-CORE PROCESSOR; OPTIMIZATION PROBLEMS; OVER FITTING PROBLEM; SUBSPACE IDENTIFICATION METHODS; THERMAL MODEL; THERMAL MODELING AND CHARACTERIZATION;

COMPUTER ARCHITECTURE;

EID: 77953097953     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/date.2010.5456979     Document Type: Conference Paper

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