Large-area nanosilver die-attach by hot-pressing below 200°C and 5 MPa

Proceedings - IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2012

Volumn , Issue , 2012, Pages 129-134

  Xiao, Kewei ^a,b   Calata, Jesus N ^a,b   Zheng, Hanguang ^a,b   Ngo, Khai D T ^a   Lu, Guo Quan ^a,b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

High temperature packaging; Large area die attach; Low temperature hot pressing; Nanosilver sintered joint

Indexed keywords

DIE-ATTACH; FRACTIONAL FACTORIAL DESIGNS; HIGH-TEMPERATURE PACKAGING; LOW TEMPERATURES; PROCESSING EQUIPMENT; PROCESSING PARAMETERS; SINTERED JOINT; UNIAXIAL PRESSURES;

ATMOSPHERIC PRESSURE; BONDING; CHIP SCALE PACKAGES; DESIGN OF EXPERIMENTS; DIES; DRYING; PRESSES (MACHINE TOOLS); SEMICONDUCTOR DEVICES;

SINTERING;

EID: 84876737244     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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