Highly reliable double-sided bonding used in double-sided cooling for high temperature power electronics

Proceedings - IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2012

Volumn , Issue , 2012, Pages 45-50

  Yoon, Sang Won ^a   Glover, Michael D ^b   Mantooth, H Alan ^b   Shiozaki, Koji ^a  

^a Toyota Motor North America Inc   (United States)

^b UNIVERSITY OF ARKANSAS   (United States)

Author keywords

Copper; Double sided bonding; Double sided cooling; Tin; Transient liquid phase bonding

Indexed keywords

ASSEMBLY PROCESS; AUTOMOTIVE POWER ELECTRONICS; DIRECT BONDED COPPERS; DOUBLE-SIDED COOLING; HIGH TEMPERATURE POWER ELECTRONICS; MATERIAL IDENTIFICATION; TRANSIENT LIQUID PHASE; TRANSIENT LIQUID PHASE BONDING;

COOLING; COPPER; ELECTRIC CONDUCTIVITY; HIGH TEMPERATURE OPERATIONS; OPTICAL MICROSCOPY; TIN;

POWER ELECTRONICS;

EID: 84876704374     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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