SCOPUS 정보 검색 플랫폼

Computational Materials Science

Volumn 73, Issue , 2013, Pages 113-119

Multiple cracking of thin films due to residual stress combined with bending stress

(5) Fu, Y a Zhang, X C a Xuan, F Z a Tu, S T a Wang, Z D a

a EAST CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

Author keywords

Film strength; Fracture energy; Multiple cracking; Residual stress; Thin film

Indexed keywords

CLOSED FORM SOLUTIONS; EXPERIMENTAL MEASUREMENTS; FILM STRENGTHS; MULTIPLE CRACKING; SOFT SUBSTRATES; STRENGTH CRITERIA; SUBSTRATE SYSTEM; YTTRIA-STABILIZED ZIRCONIA FILMS;

FRACTURE ENERGY; RESIDUAL STRESSES; STRESS CONCENTRATION; THIN FILMS; YTTRIA STABILIZED ZIRCONIA; ZIRCONIA;

CRACKS;

EID: 84875445143 PISSN: 09270256 EISSN: None Source Type: Journal
DOI: 10.1016/j.commatsci.2013.01.038 Document Type: Article

Times cited : (17)

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