Analytical modeling of edge effects on the residual stresses within the film/substrate systems. I. Interfacial stresses

Journal of Applied Physics

Volumn 100, Issue 11, 2006, Pages

  Zhang, X C ^a,b   Xu, B S ^a   Wang, H D ^a   Wu, Y X ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b NATIONAL KEY LABORATORY FOR REMANUFACTURING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SUBSTRATES; SURFACE CHEMISTRY;

ANALYTICAL MODELS; FILM WIDTH; INTERFACIAL STRESSES;

RESIDUAL STRESSES;

EID: 33845754519     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2400087     Document Type: Article

References (33)

1. C. H. Hsueh, J. Appl. Phys. 88, 3022 (2000).
2. P. Murry and G. F. Carey, J. Appl. Phys. 65, 3667 (1989).
3. S. Logothetidis and S. Boultadakis, J. Appl. Phys. 78, 5362 (1995).
4. S. C. Jain, H. E. Maes, K. Pinardi, and I. De. Wolf, J. Appl. Phys. 79, 8145 (1996).
5. S. C. Jain, A. H. Harker, A. A. Atkinson, and K. Pinardi, J. Appl. Phys. 78, 1630 (1995).
6. C. A. Klein, J. Appl. Phys. 88, 5487 (2000).
7. X. C. Zhang, B. S. Xu, H. D. Wang, and Y. X. Wu, J. Appl. Phys. 98, 053516 (2005).
8. P. H. Townsend, D. M. Barnett, and T. A. Brunner, J. Appl. Phys. 62, 4438 (1987).
9. C. H. Hsueh, Thin Solid Films 418, 182 (2002).
10. X. C. Zhang, B. S. Xu, H. D. Wang, and Y. X. Wu, Thin Solid Films 488, 274 (2005).
11. S. M. Hu, J. Appl. Phys. 50, 4661 (1979).
12. B. J. Aleck, J. Appl. Mech. 16, 118 (1949).
13. M. S. Hess, J. Compos. Mater. 3, 262 (1969).
14. M. S. Hess, J. Compos. Mater. 3, 630 (1969).
15. S. M. Hu, Appl. Phys. Lett. 32, 5 (1978).
16. L. W. Yin, J. Electron, J. Electron. Packag. 113, 68 (1991).
17. M. Lee and I. Jasiuk, J. Electron. Packag. 113, 173 (1991).
18. T. T. Chen, H. C. Wu, and C. L. Lin, J. Cryst. Growth 249, 44 (2003).
19. S. Timoshenko, J. Opt. Soc. Am. 11, 23 (1925).
20. F. F. Zhang, Appl. Math. Mech. 4, 347 (1983) (In Chinese).
21. E. Suhir, J. Appl. Mech. 53, 657 (1986).
22. E. Suhir, J. Appl. Mech. 56, 595 (1989).
23. B. A. Mirman and S. Knecht, IEEE Trans. Compon., Hybrids, Manuf. Technol. 13, 914 (1990).
24. B. A. Mirman, J. Electron. Packag. 114, 384 (1992).
25. B. A. Mirman, J. Electron. Packag. 114, 389 (1992).
26. C. C. Chiu and Y. Liou, Thin Solid Films 268, 91 (1995).
27. E. Suhir, J. Appl. Phys. 88, 2363 (2000).
28. J. Klein, Opt. Eng. (Bellingham) 40, 1115 (2001).
29. E. Shuir, J. Appl. Phys. 89, 3685 (2001).
30. J. W. Eischen, C. Chung, and J. Kim, J. Electron. Packag. 112, 16 (1990).
31. X. C. Zhang, B. S. Xu, H. D. Wang, and Y. X. Wu, Mater. Sci. Eng., A (submitted under review).
32. C. Godoy, E. A. Souza, M. M. Lima, and J. C. A. Batista, Thin Solid Films 420/421, 438 (2002).
33. D. B. Bogy, J. Appl. Mech. 35, 460 (1968).