Mechanism of controlled crack formation in thin-film dielectrics

Applied Physics Letters

Volumn 86, Issue 20, 2005, Pages 1-3

  Mani, Sathya ^a   Saif, Taher M ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROFABRICATION INDUSTRY; MUD CRACKS; PLASMA DEPOSITION; THIN-FILM DIELECTRICS;

ANNEALING; CRACK INITIATION; PHOTORESISTS; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SILICON; TENSILE STRESS; THIN FILMS;

DIELECTRIC MATERIALS;

EID: 20844443659     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1927267     Document Type: Article

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