Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2013, Pages 271-274

  Tanaka, Shuji ^a   Yoshida, Masaki ^a   Hirano, Hideki ^a   Somekawa, Toshihiro ^b   Fujita, Masayuki ^b   Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b INSTITUTE FOR LASER TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENT MATERIALS; INTEGRATION TESTS; PERMANENT BONDING; PHYSICAL CONTACTS; ROOM TEMPERATURE; SAW RESONATORS; TRANSFER TECHNOLOGIES; UNDERFILLS;

DEBONDING; ELASTICITY; FLIP CHIP DEVICES; INTEGRATION; MEMS; SILICONES; THERMAL EXPANSION;

WAFER BONDING;

EID: 84875430531     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2013.6474230     Document Type: Conference Paper

References (11)

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