Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits

Electrochimica Acta

Volumn 97, Issue , 2013, Pages 132-142

  Liu, Jun ^a   Liu, Changqing ^b   Conway, Paul P ^b  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Copper; Deposition parameter; Electrodeposition; Kinetic Monte Carlo simulation; Polycrystalline

Indexed keywords

DEPOSITION PARAMETERS; ELECTRODE POTENTIALS; GRAIN BOUNDARY MISORIENTATION; INDIVIDUAL GRAINS; KINETIC MONTE CARLO; KINETIC MONTE CARLO SIMULATION; POLYCRYSTALLINE; POLYCRYSTALLINE COPPER;

COMPUTER SIMULATION; COPPER; DEPOSITS; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; KINETICS; MICROSTRUCTURE; MONTE CARLO METHODS; SUBSTRATES;

COPPER DEPOSITS;

EID: 84875361096     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2013.02.112     Document Type: Article

References (16)

1. D. Dobrev, J. Vetter, N. Angert, and R. Neumann Electrochemical growth of copper single crystals in pores of polymer ion-track membranes Applied Physics A-Materials Science and Processing 69 1999 233
2. L. Xu, P. Dixit, J. Miao, J.H.L. Pang, X. Zhang, K.N. Tu, and R. Preisser Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins Applied Physics Letters 90 2007 033111
3. J. Liu, C. Liu, and P.P. Conway Kinetic Monte Carlo simulation of kinetically-limited copper electro-crystallisation on an atomically even surface Electrochimica Acta 54 2009 6941
4. Y.Y. Huang, Y.C. Zhou, and Y. Pan Simulation of kinetically limited growth of electrodeposited polycrystalline Ni films Physica E 41 2009 1673
5. D.Y. Li, and J.A. Szpunar A Monte Carlo simulation approach to the texture formation during electrodeposition-I. The simulation model Electrochimica Acta 42 1997 37
6. J. Liu, C. Liu, and P.P. Conway Kinetic Monte Carlo simulation of electrodeposition of polycrystalline Cu Electrochemistry Communications 11 2009 2207
7. J.E. Rubio, M. Jaraiz, I. Martin-Bragado, J.M. Hernandez-Mangas, J. Barbolla, and G.H. Gilmer Atomistic Monte Carlo simulations of three-dimensional polycrystalline thin films Journal of Applied Physics 94 2003 163
8. J. Amar The Monte Carlo method in science and engineering Computing in Science and Engineering 8 2006 9
9. H. Huang, G.H. Gilmer, and T.D. de la Rubia An atomistic simulator for thin film deposition in three dimensions Journal of Applied Physics 84 1998 3636
10. K.A. Fichthorn, and W.H. Weinberg Theoretical foundations of dynamical Monte Carlo simulations Journal of Chemical Physics 95 1991 1090
11. P. Bruschi, A. Nannini, and F. Pieri Monte Carlo simulation of polycrystalline thin film deposition Physical Review B 63 2000 035406
12. A. Radisic, Electrochemical nucleation and growth of copper, Ph.D. Thesis, Johns Hopkins University, 2004.
13. T.O. Drews, Multiscale simulations of nanofabricated structures: application to copper electrodeposition for electronic devices, Ph.D. Thesis, University of Illinois at Urbana-Champaign, 2004.
14. T.O. Drews, A. Radisic, J. Erlebacher, R.D. Braatz, P.C. Searson, and R.C. Alkire Stochastic simulation of the early stages of kinetically limited electrodeposition Journal of the Electrochemical Society 153 2006 C434
15. S.C. Barnes, G.G. Storey, and H.J. Pick The structure of electrodeposited copper-iii: the effect of current density and temperature on growth habit Electrochimica Acta 2 1960 195
16. Z. Zheng, R.M. Stephens, R.D. Braatz, R.C. Alkire, and L.R. Petzold A hybrid multiscale kinetic Monte Carlo method for simulation of copper electrodeposition Journal of Computational Physics 227 2008 5184