All hot wire chemical vapor deposition low substrate temperature transparent thin film moisture barrier

Thin Solid Films

Volumn 532, Issue , 2013, Pages 84-88

  Spee, D A ^a   Schipper, M R ^a   Van Der Werf, C H M ^a   Rath, J K ^a   Schropp, R E I ^a  

^a UTRECHT UNIVERSITY   (Netherlands)

Author keywords

Flexible electronics; Hot wire chemical vapor deposition; Moisture barrier; Thin film encapsulation

Indexed keywords

CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES; HOT WIRE CHEMICAL VAPOR DEPOSITION; LOW SUBSTRATE TEMPERATURE; LOW-TEMPERATURE SILICONS; MOISTURE BARRIERS; THIN FILM ENCAPSULATION; THREE-LAYER STRUCTURES; WATER VAPOR TRANSMISSION RATE;

CHEMICAL VAPOR DEPOSITION; FILM PREPARATION; FLEXIBLE ELECTRONICS; MOISTURE; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; WIRE;

VAPORS;

EID: 84875220607     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2012.11.146     Document Type: Article

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