Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface

Scripta Materialia

Volumn 64, Issue 7, 2011, Pages 633-636

  Wang, Jin Yi ^a   Lin, Chih Fan ^a   Chen, Chih Ming ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Annealing; Intermetallic compounds; Lead free solder; Soldering

Indexed keywords

COOLING RATES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; LOCAL EQUILIBRIUM; REFLOW PROCESS; SOLID-STATE ANNEALING;

ANNEALING; FRACTURE; INTERMETALLICS; LEAD COMPOUNDS; SOLDERING; SOLDERING ALLOYS; TIN; ZINC;

PHASE INTERFACES;

EID: 79251596589     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2010.12.006     Document Type: Article

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