Planar bond all: A new packaging technology for advanced automotive power modules

2012 IEEE Energy Conversion Congress and Exposition, ECCE 2012

Volumn , Issue , 2012, Pages 438-443

  Liang, Zhenxian ^a   Ning, Puqi ^a   Wang, Fred ^a   Marlino, Laura ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DOUBLE SIDED; ELECTRICAL CONVERSION EFFICIENCIES; ELECTRICAL INTERCONNECTIONS; HEATING PROCESS; IDENTICAL MATERIALS; INTEGRATED COOLING; PACKAGING STRUCTURE; PACKAGING TECHNOLOGIES; POWER MODULE; POWER SEMICONDUCTOR SWITCHES; POWER SWITCHES; SPECIAL FIXTURES; THREEDIMENSIONAL (3-D);

CHIP SCALE PACKAGES; CONVERSION EFFICIENCY; COOLING SYSTEMS; EXHIBITIONS; POWER ELECTRONICS;

SUBSTRATES;

EID: 84870890802     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECCE.2012.6342788     Document Type: Conference Paper

References (15)

1. U.S. Department of Energy, "Evaluation of 2004 Toyota Prius Hybrid Electric Drive System," Tech. Rep. ORNL/TM-2006/423, May 2006.
2. Natsuki Nozawa, Takeshi Maekawa, Shigeyuki Nozawa, and Ken Asakura, "Development of power control unit for compact-class vehicle," Proc. 2009 SAE International Conference, p. 2009-01-1310.
3. Tetsuya Ueda, Naoki Yoshimatsu, Nobuyoshi Kimoto, Dai Nakajima, Masao Kikuchi, and Toshiaki Shinohara, "Simple, compact, robust, and high-performance power module T-PM (Transfer-molded Power Module)," in Proc. of the 22nd International Symposium on Power Semiconductor Devices & ICs, Hiroshima, Japan, June 2010, pp. 47-50.
4. Yasuyuki Sakai, Hiroshi Ishiyama, and Takaji Kikuchi, "Power control unit for high power hybrid system," Proc. 2007 SAE International Conference, p. 2007-01-0271.
5. Zhenxian Liang, "Status and Trend of Automotive Power Module Packaging," in Proc. of the 24th International Symposium on Power Semiconductor Devices & ICs, Bruge, Belgium, June 2012, pp. 325-331.
6. Infineon Technologies, "HybridPack 1," product information, available online at http://www.infineon.com.
7. Natsuki Nozawa, Takeshi Maekawa, Shigeyuki Nozawa, and Ken Asakura, "Development of power control unit for compact-class vehicle," Proc. 2009 SAE International Conference, p. 2009-01-1310.
8. Sayeed Ahmed, "Putting the electrical power in hybrid powertrains," Auto Electronics, May/June 2007, p. 22.
9. T. Sasaki, H. Takao, T. Shikano, S. Fujifa, D. Nakajima, and T. Shinohma, "Development of high current transfer-mold type power module with high heat-cycle durability," Proc. of 2004 International Symposium on Power Semiconductor Devices & ICs, Kitakyushu, Japan, 2004, p. 33,.
10. Yoshinori Sato, Shigeaki Ishikawa, Takahito Okubo, Makoto Abe, and Katsunori Tamai, "Development of High response motor and inverter system for the Nissan LEAF electric vehicle," Proc. 2011 SAE International Conference, p. 2011-01-0350.
11. Arendt Wintrich, "Power modules for electric and hybrid vehicles," Bodo's Power Systems, February 2009, p. 24.
12. Hsueh-Rong Chang, Jiankang Bu, George Kong, and Ricky Labayen, "300 A, 650 V, 70 |im thin IGBTs with double-sided cooling," in Proc. of the 23rd International Symposium on Power Semiconductor Devices & ICs, San Diego, California, May 2011, pp. 320-323.
13. Thomas Stockmeier, Peter Beckedahl, Christian Goebl, and Thomas Malzer, "Skin: double side sintering technology for new packages," in Proc. of the 23rd International Symposium on Power Semiconductor Devices & ICs, San Diego, California, May 2011, pp. 324-327
14. Zhenxian Liang, Puqi Ning, Fred Wang, Laura Marlino, "Reducing Parasitic Electrical Parameters With a Planar Interconnection Packaging Structure," in Proc. of the 7th International Conference on Integrated Power Electronics System (CIPS'12), Nuremberg, Germany, 6-8 March, 2012, pp. 374-379.
15. Puqi Ning, Zhenxian Liang, Fred Wang, Laura Marlino, "Power Module and Cooling System Thermal Performance Evaluation for HEV Application," in Proc. of the 27th IEEE Annual Applied Power Electronics Conference and Exposition (APEC 2012), Orlando, FL, Feb 6-9, 2012, pp.2134-2139.