Development of high current transfer-mold type power module with high heat-cycle durability

IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Volumn 16, Issue , 2004, Pages 293-296

  Sasaki, T ^a   Takao, H ^a   Shikano, T ^a   Fujita, S ^a   Nakajima, D ^b   Shinohara, T ^a  

^a Fukuryo Semicon Engineering Corporation   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DURABILITY; HEAT LOSSES; SOLDERED JOINTS; STRENGTH OF MATERIALS; THERMAL CYCLING; TRANSFER MOLDING;

HIGH HEAT CYCLE DURABILITY; INDUSTRIAL MOTOR DRIVE SYSTEMS; POWER MODULES;

POWER ELECTRONICS;

EID: 4944262468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. S. Noda, K. H. Hussein, S. Yamada, G. Majmndar, E. Thal and G. Debelt, "A novel supper compact intelligent power module," PCIM'97, pp. 1-9, 1997
2. K. Hayashi, H. Kawafuji, K. Uchida, K. M. Tajiri and T. Shikano, "Novel structure and its assembling techniques for DIP-IPM to improve heat dissipation," 10th Symposium on Microjoining and Assembly Technology in Electronics, pp 479-482, 2004 (in Japanese)
3. F. Hua "Pb-free solder challenges in electronic packaging and assembly," 2003 Electronic Components and Technology Conference, pp. 58-63, 2003