Status and trend of automotive power packaging

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2012, Pages 325-331

  Liang, Zhenxian ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

electric drive; hybrid electric electric vehicles; packaging; power module; power semiconductor

Indexed keywords

DEVELOPMENT DIRECTIONS; ELECTRIC-DRIVE VEHICLES; FORM FACTORS; INDUSTRIAL PRODUCT; POWER ELECTRONICS MODULES; POWER MODULE; POWER PACKAGING; POWER SEMICONDUCTORS; PROCESSING TECHNIQUE; TECHNICAL DETAILS; TECHNICAL DEVELOPMENT;

APPROXIMATION THEORY; ELECTRIC DRIVES; ELECTRIC VEHICLES; POWER ELECTRONICS;

PACKAGING;

EID: 84864742347     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2012.6229088     Document Type: Conference Paper

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