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Volumn , Issue , 2011, Pages 324-327
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SKiN: Double side sintering technology for new packages
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
DOUBLE SIDES;
FLEXIBLE CIRCUIT BOARDS;
PIN FIN HEAT SINKS;
POWER CHIPS;
POWER DEVICES;
RELIABILITY PERFORMANCE;
RENEWABLE ENERGIES;
VARIABLE SPEED;
AUTOMOBILE MANUFACTURE;
ELECTRIC DRIVES;
FLEXIBLE ELECTRONICS;
HEAT SINKS;
SINTERING;
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EID: 84870886636
PISSN: 10636854
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISPSD.2011.5890856 Document Type: Conference Paper |
Times cited : (98)
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References (5)
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