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Volumn , Issue , 2011, Pages 324-327

SKiN: Double side sintering technology for new packages

Author keywords

[No Author keywords available]

Indexed keywords

DOUBLE SIDES; FLEXIBLE CIRCUIT BOARDS; PIN FIN HEAT SINKS; POWER CHIPS; POWER DEVICES; RELIABILITY PERFORMANCE; RENEWABLE ENERGIES; VARIABLE SPEED;

EID: 84870886636     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2011.5890856     Document Type: Conference Paper
Times cited : (98)

References (5)
  • 1
    • 77956576750 scopus 로고    scopus 로고
    • Failure mechanism and improvement potential of IGBTs short circuit operation
    • Hiroshima, 2010
    • F. Hille, F. Umbach, T. Raker: "Failure mechanism and improvement potential of IGBTs short circuit operation" Proc. ISPSD 2010, pp. 33, Hiroshima, 2010
    • (2010) Proc. ISPSD , pp. 33
    • Hille, F.1    Umbach, F.2    Raker, T.3
  • 2
    • 77956552780 scopus 로고    scopus 로고
    • Performance, trends and limitations of power electronic systems
    • Nuremberg,2010
    • J.W. Kolar: "Performance, Trends and Limitations of Power Electronic Systems", Proc. CIPS 2010, pp.17, Nuremberg,2010
    • (2010) Proc. CIPS , pp. 17
    • Kolar, J.W.1
  • 3
    • 79953755246 scopus 로고    scopus 로고
    • Low temperature sinter technology die attachment for power electronic applications
    • Nuremberg, 2010
    • C. Göbl: "Low Temperature Sinter Technology Die Attachment for Power Electronic Applications" Proc. CIPS 2010, pp. 327, Nuremberg, 2010
    • (2010) Proc. CIPS , pp. 327
    • Göbl, C.1
  • 4
    • 84880737195 scopus 로고    scopus 로고
    • German Patent: DE 10 2007 006 706
    • German Patent: DE 10 2007 006 706
  • 5
    • 84881106889 scopus 로고    scopus 로고
    • Performance comparison of traditional packaging technologies to a novel bond wire less all sintered power module
    • Nuremberg
    • P. Beckedahl, M. Hermann, M. Kind, M. Knebel, J. Nascimento, A. Wintrich: "Performance comparison of traditional packaging technologies to a novel bond wire less all sintered power module" Proc. PCIM 2011, Nuremberg, 2011
    • (2011) Proc. PCIM 2011
    • Beckedahl, P.1    Hermann, M.2    Kind, M.3    Knebel, M.4    Nascimento, J.5    Wintrich, A.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.