High temperature lead-free attach reliability

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 93-98

  McCluskey, Patrick ^a   Quintero, Pedro O ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIE ATTACH TECHNOLOGIES; ELECTRONIC PRODUCTS; SOLDER ATTACH;

ENERGY GAP; LEAD; MICROSTRUCTURE; PRODUCT DEVELOPMENT; SEMICONDUCTOR MATERIALS; THERMAL CYCLING; TOXIC MATERIALS;

ELECTRONICS PACKAGING;

EID: 40449085934     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33457     Document Type: Conference Paper

References (9)