A novel technique for MEMS packaging: Reactive bonding with integrated material systems

Sensors and Actuators, A: Physical

Volumn 188, Issue , 2012, Pages 212-219

  Braeuer, J ^a   Besser, J ^a   Wiemer, M ^a   Gessner, T ^a,b  

^a FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Exothermic reaction; Integrated reactive material systems; Low temperature MEMS packaging; Nano scale multilayer; Reactive bonding

Indexed keywords

3-D INTEGRATION; BONDING PROCESS; DIRECT DEPOSITION; HEAT SOURCES; INTEGRATED MATERIALS; LOW-TEMPERATURE BONDING PROCESS; MEMS PACKAGING; MICRO-COMPONENTS; MICRO-MECHANICAL; MULTI-LAYER SYSTEM; NANO SCALE; NOVEL TECHNIQUES; REACTIVE MATERIALS; SELF-PROPAGATING; SOLDER BONDING;

BONDING; EXOTHERMIC REACTIONS; MICROELECTRONICS; MICROOPTICS; MULTILAYERS; TEMPERATURE;

MATERIALS SCIENCE;

EID: 84870054694     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2012.01.015     Document Type: Conference Paper

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