Clean and conductive wafer bonding for MEMS

ECS Transactions

Volumn 16, Issue 8, 2009, Pages 117-124

  Yun, C H ^a   Martin, J R ^a   Chen, L ^a   Frey, T J ^a  

^a ANALOG DEVICES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; SILICON WAFERS;

BONDING PROCESS; BONDING TECHNOLOGY; HIGH YIELD; MEMS ACCELEROMETER; PROCESS YIELD;

WAFER BONDING;

EID: 63149146209     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2982860     Document Type: Conference Paper

References (8)

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3. th Int. Symp. Microelectronics, p. 402, International Microelectronics and Packaging Society, Washington, District of Columbia (2003).
4. MIL-STD-883E Method 2019.7 (2003)
5. C. H. Yun, N. Quitoriano, and N. W. Cheung, Appl. Phys. Lett., 82, 1544 (2003).
6. C. H. Yun, J. R. Martin, E. B. Tarvin, and J. T. Winbigler, in MEMS 2008 Technical Digest, p. 810, Institute of Electrical and Electronics Engineers, Piscataway, New Jersey (2008).
7. C. H. Yun, J. R. Martin, T. Chen, and D. Davis, in The 14th International Conference on Solid-State Sensors, Actuators and Microsystems, p. 2091, Institute of Electrical and Electronics Engineers, Piscataway, New Jersey (2007).
8. T. Adams and K. T. Turner, Advance Packaging, p. 12, PennWell, Nashua, New Hampshire (July 2008).