Reactive bonding and low temperature bonding of heterogeneous materials

ECS Transactions

Volumn 33, Issue 4, 2010, Pages 307-318

  Wiemer, M ^a   Braeuer, J ^a   Wuensch, D ^b   Gessner, T ^a,b  

^a FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COATINGS; AMORPHOUS SILICON; ATMOSPHERIC PRESSURE; HERMETIC SEALS; LITHIUM TANTALATE; LOW TEMPERATURE OPERATIONS; MICROELECTRONICS; MULTILAYER FILMS; NANOTECHNOLOGY; SILICON WAFERS; TANTALUM COMPOUNDS; TEMPERATURE;

ATMOSPHERIC PRESSURE PLASMAS; HERMETIC SEALING; HETEROGENEOUS MATERIALS; JOINING TECHNIQUES; LOW TEMPERATURE BONDING; MICROELECTRONIC PACKAGE; ROOM TEMPERATURE BONDING; WAFER LEVEL BONDINGS;

WAFER BONDING;

EID: 79952633076     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3483520     Document Type: Conference Paper

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