Thickness and temperature dependent thermal conductivity of nanoscale tin films

ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011

Volumn 4, Issue PARTS A AND B, 2011, Pages 1757-1766

  Kaul, Pankaj B ^a   Prakash, Vikas ^a  

^a Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRON SCATTERING; GRAIN BOUNDARIES; METALLIC FILMS; SYSTEMS ANALYSIS; TEMPERATURE; THICKNESS MEASUREMENT; THIN FILMS; TIN;

BOUNDARY SURFACES; GRAIN BOUNDARY SCATTERING; LOWER TEMPERATURES; MEAN-GRAIN SIZE; PROFILOMETERS; SIZE EFFECTS; TEMPERATURE-DEPENDENT THERMAL CONDUCTIVITY; TWIN BOUNDARIES;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84869186752     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/imece2011-65576     Document Type: Conference Paper

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