Thermal diffusivity of metallic thin films: Au, Sn, Mo, and Al/Ti alloy

International Journal of Thermophysics

Volumn 27, Issue 5, 2006, Pages 1551-1563

  Choi, Sun Rock ^a   Kim, Dongsik ^a   Choa, Sung Hoon ^b  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Ac calorimetric method; AlTi alloy; Au; Metal; Mirage technique; Mo; Sn; Thermal diffusivity; Thin film

Indexed keywords

CALORIMETRY; ELECTRIC CONDUCTIVITY; METALLIC FILMS; MICROELECTROMECHANICAL DEVICES; SCATTERING; THERMAL DIFFUSION;

AC CALORIMETRIC METHOD; ALTI ALLOY; MIRAGE TECHNIQUE; THERMAL DIFFUSIVITY;

THIN FILMS;

EID: 33750980409     PISSN: 0195928X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10765-006-0118-2     Document Type: Article

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