Tensile and fatigue behaviors of printed Ag thin films on flexible substrates

Applied Physics Letters

Volumn 101, Issue 19, 2012, Pages

  Sim, Gi Dong ^a   Won, Sejeong ^a   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ECO-FRIENDLY; ELECTRON BEAM EVAPORATION; EVAPORATED FILMS; FAILURE MECHANISM; FATIGUE BEHAVIOR; FLEXIBLE SUBSTRATE; INTERGRANULAR FRACTURE; KEY TECHNOLOGIES; SILVER THIN FILMS;

FATIGUE OF MATERIALS; PHOTOLITHOGRAPHY; PLASTIC BOTTLES; PRINTING; SUBSTRATES; THIN FILMS;

SILVER;

EID: 84869073605     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4766447     Document Type: Article

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