Reliability of gravure offset printing under various printing conditions

Journal of Applied Physics

Volumn 108, Issue 10, 2010, Pages

  Lee, Taik Min ^a   Noh, Jae Ho ^a   Kim, Inyoung ^a   Kim, Dong Soo ^a   Chun, Sangki ^b  

^a Korea Institute of Machine and Materials   (South Korea)

^b LG Chemical Ltd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION MODEL; CONTACT TIME; EXPERIMENTAL ERRORS; PRINTING CONDITIONS; PRINTING PROCESS; SOLVENT ABSORPTION;

ABSORPTION; LITHOGRAPHY; OFFSET PRINTING; PRINTING PRESSES; RELIABILITY;

GRAPHIC METHODS;

EID: 78650286145     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3510466     Document Type: Conference Paper

References (17)

1. J. P. Boeuf, J. Phys. D: Appl. Phys. JPAPBE 0022-3727 36, R53 (2003). 10.1088/0022-3727/36/6/201
2. P. McGuire, J. C. Cha, H. Kikuchi, and A. Yoda, IMID07 Digest, Daegu, Korea, 27-31 August 2007, pp. 313-315.
3. D. B. Wallace and D. J. Hayes, Int. J. Microcircuits Electron. Packag. IMEPE5 1063-1674 21, 73 (1998).
4. T. -M. Lee, T. G. Kang, J. S. Yang, J. Jo, K. -Y. Kim, B. -O. Choi, and D. -S. Kim, J. Manuf. Sci. 130, 031113 (2008). 10.1115/1.2917367
5. T. -M. Lee, T. G. Kang, J. S. Yang, J. Jo, K. -Y. Kim, B. -O. Choi, and D. -S. Kim, IEEE Trans. Electron. Packag. Manuf. ITEPFL 1521-334X 31, 202 (2008). 10.1109/TEPM.2008.926285
6. W. Jiang, H. Liu, Y. Ding, Y. Tang, Y. Shi, L. Yin, and B. Lu, J. Micromech. Microeng. JMMIEZ 0960-1317 19, 015033 (2009). 10.1088/0960-1317/19/1/ 015033
7. T. -M. Lee, Y. -J. Choi, S. -Y. Nam, C. -W. You, D. -Y. Na, H. -C. Choi, D. -Y. Shin, K. -Y. Kim, and K. -I. Jung, Thin Solid Films THSFAP 0040-6090 516, 7875 (2008). 10.1016/j.tsf.2008.05.044
8. M. Pudas, J. Hagberg, and S. Leppävuori, IEEE Trans. Electron. Packag. Manuf. ITEPFL 1521-334X 25, 335 (2002). 10.1109/TEPM.2002.807728
9. M. Pudas, Gravure-Offset Printing in the Manufacture of Ultra-Fine-Line Thick-Films for Electronics (Oulu University Press, Oulu, 2004).
10. S. Leppävuon, J. Vääbänen, M. Lahtl, J. Remes, and A. Uusimäki, Sens. Actuators, A SAAPEB 0924-4247 42, 593 (1994). 10.1016/0924-4247(94)80060-X
11. W. -X. Huang, S. -H. Lee, H. W. Kang, H. J. Sung, T. -M. Lee, and D. -S. Kim, Int. J. Heat Fluid Flow IJHFD2 0142-727X 29, 1436 (2008). 10.1016/j.ijheatfluidflow.2008.07.002
12. H. W. Kang, H. J. Sung, T. -M. Lee, D. -S. Kim, and C. -J. Kim, J. Micromech. Microeng. JMMIEZ 0960-1317 19, 015025 (2009). 10.1088/0960-1317/19/1/ 015025
13. T. Frecska, Screen Print. 74, 156 (1984).
14. M. Shimada, H. Watanabe, M. Tsukamoto, and T. Ishida, Proc. IMC, Tokyo, Japan, May 24-26, 1990, pp. 581-586.
15. S. Niedziella, S. Rudkin, and M. Cooke, J. Chromatogr. A ZZZZZZ 885, 457 (2000). 10.1016/S0021-9673(00)00109-6 (Pubitemid 30392495)
16. J. Lee, C. Park, and G. M. Whitesides, Anal. Chem. ANCHAM 0003-2700 75, 6544 (2003). 10.1021/ac0346712 (Pubitemid 37493912)
17. T. -M. Lee, S. Hur, J. -H. Kim, and H. -C. Choi, J. Micromech. Microeng. JMMIEZ 0960-1317 20, 015016 (2010). 10.1088/0960-1317/20/1/015016