Hydrogen-plasma-assisted hybrid atomic layer deposition of Ir thin film as novel Cu diffusion barrier

Surface and Coatings Technology

Volumn 211, Issue , 2012, Pages 14-17

  Song, Sang In ^a   Lee, Jong Ho ^a   Choi, Bum Ho ^a   Lee, Hong Kee ^a   Shin, Dong Chan ^b   Lee, Jin Wook ^c  

^a Korea Institute of Industrial Technology   (South Korea)

^b Chosun University   (South Korea)

^c Process Development Division   (South Korea)

Author keywords

ALD; Diffusion barrier; Hybrid; Hydrogen; Ir

Indexed keywords

ADSORPTION RATES; ALD; CU DIFFUSION BARRIER; DEPOSITION CYCLES; EFFECT OF HYDROGEN; FILM QUALITY; GROWTH BEHAVIOR; HYBRID; HYDROGEN PLASMAS; LINEAR RELATIONSHIPS; MASS PRODUCTION; METAL ORGANIC PRECURSORS; METAL PRECURSOR; PLASMA-ENHANCED ATOMIC LAYER DEPOSITION; POLYCRYSTALLINE; PREFERENTIAL GROWTH; PROCESS TIME; RATE OF ADSORPTION; REACTANT SPECIES; SHARP INTERFACE; SI SUBSTRATES;

ADSORPTION; DEPOSITION; DIFFUSION BARRIERS; HYDROGEN; IRIDIUM; MIXING; PULSED LASER DEPOSITION; SILICON; SUBSTRATES; THIN FILMS; VAPOR DEPOSITION; VOLTAGE DIVIDERS; X RAY DIFFRACTION ANALYSIS;

ATOMIC LAYER DEPOSITION;

EID: 84868638202     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.09.074     Document Type: Article

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