Electroless deposition of biocompatible Ag/W on quartz for the purpose of variotherm micro molding

Journal of Materials Processing Technology

Volumn 213, Issue 2, 2013, Pages 136-142

  Yung, K L ^a   Xu, Yan ^a   Kang, C L ^a   Jiang, Bo Quan ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Coatings; Electroless plating; Quartz glass; Silver; Tungsten

Indexed keywords

COATINGS; DEPOSITION RATES; ELECTROLESS PLATING; GLASS; MOLDING; SILVER; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY; TUNGSTEN;

COATING METALS; COMPLEXING AGENTS; FABRICATION PROCESS; KINETIC MODELS; LOW THERMAL CONDUCTIVITY; MALIC ACIDS; MICRO MOLDING; MOLDING PROCESS; QUARTZ GLASS; QUARTZ SURFACES; VOLUMETRIC RATIO;

QUARTZ;

EID: 84867806430     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2012.09.008     Document Type: Article

References (26)

1. 2 separation Journal of Natural Gas Chemistry 17 2008 321 326
2. V. Bogsh, A. Inberg, N. Croitoru, V. Dobin, and Y. Shacham-Diamand Electroless deposition of novel Ag/W thin films Microelectronic Engineering 70 2003 489 494
3. V. Bogsh, A. Inberg, N. Croitoru, V. Dobin, and Y. Shacham-Diamand Material properties of very thin electroless silver-tungsten Thin Solid Films 426 2003 288 295
4. E.E. Glickman, A. Inberg, V. Bogush, G. Aviram, N. Croitoru, and Y. Shacham-Diamand Role of local microchemistry and surface structure in electrical resistivity of 50 nm electroless films Ag-W-oxygen Microelectronic Engineering 82 2005 307 313
5. E.E. Glickman, A. Inberg, V. Bogush, G. Aviram, N. Croitoru, and Y. Shacham-Diamand On the mechanism of annealing effect in electrical resistivity of sub-100 nm Ag (1% W) films Microelectronic Engineering 76 2004 182 189
6. C.A. Griffiths, S.S. Dimov, and E.B. Brousseau The effects of tool surface quality in micro-injection moulding Journal of Materials Processing Technology 189 2007 418 427
7. K.S. Han, S.H. Hong, and J.H. Jeong Fabrication of sub-micron 3D structure using duo-mold UV-RIL process Microelectronic Engineering 87 2010 610 613
8. M.S. Huang, C.J. Li, J.C. Yu, Y.M. Huang, and L.C. Hsieh Robust parameter design of micro-injection molded gears using a LIGA-like fabricated mold insert Journal of Materials Processing Technology 209 2009 5690 5701
9. Y. Huang, K. Shi, Z. Liao, Y. Wang, L. Wang, and F. Zhu Studies of electroless Ni-Co-P ternary alloy on glass fibers Materials Letters 61 2007 1742 1748
10. A. Inberg, V. Bogush, N. Croitoru, and Y. Shacham-Diamand Electrochemical study of the mechanism of Ag (W) electroless deposition Journal of the Electrochemical Society 154 2007 D1 D4
11. G. James Lange's Handbook of Chemistry 16th edition 2005 McGraw-Hill New York, Chicago, San Franceico Lis
12. B.Q. Jiang, L. Xiao, S.F. Hu, J. Peng, H. Zhang, and M.W. Wang Optimization and kinetics of electroless Ni-P-B plating of quartz optical fiber Optical Materials 31 2009 1532 1539
13. N. Li, and Z.M. Tu Practical Technology of Electroless Plating 2003 Chemical Industry Publishing House Beijing, China
14. B. Sha, S. Dimov, and C. Griffiths Investigation of micro-injection moulding: factors affecting the replication quality Journal of Materials Processing Technology 183 2007 284 296
15. A. Shibata, Y. Imamura, M. Sone, C. Ishiyama, and Y. Higo Pd-Ni-P metallic glass film fabricated by electroless alloy plating Thin Solid Films 517 2009 1935 1938
16. L. Xie, S. Kirchberg, and L. Steuernagel A mechanism influencing micro injection molded weld lines of hybrid nano filled polypropylene Microsystem Technologies 16 2010 1855 1859
17. Y.C. Xie, Y. Xu, K.L. Yung, L.B. Huang, and M.H. Lee Photolamination bonding for PMMA microfluidic chips Microsystem Technologies 16 2010 1887 1891
18. Y. Xu, L.B. Huang, K.L. Yung, Y.C. Xie, and M.H. Lee Low cost fabrication of microelectrodes on plastic substrate Microsystem Technologies 17 2011 361 366
19. Y. Xu, K.L. Yung, and H.P. Ng The prediction of polymer pellet conveying behavior in micro injection molding machine Polymer Engineering and Science 46 2006 1608 1612
20. H. Yan, N. Xu, W.Y. Huang, H.M. Han, and S.J. Xiao Electroless plating of silver nanoparticles on porous silicon for laser desorption/ionization mass spectrometry International Journal of Mass Spectrometry 281 2009 1 7
21. D. Yao, and B. Kim Development of rapid heating and cooling systems for injection molding applications Polymer Engineering and Science 42 2002 2471 2481
22. W.C. Ye, C.L. Ma, Y. Chang, C.M. Wang, and F. Zhou Electroless deposition of W-doped Ag films onto p-Si(1 0 0) from diluted HF solution Transactions of Nonferrous Metals Society of China 19 2009 1474 1478
23. W.C. Ye, C.L. Ma, Y. Chang, and C.M. Wang Electroless deposition of W-doped Ag dendrites from HF solution Chinese Journal of Chemistry 26 2008 1380 1384
24. W.C. Ye, C.L. Ma, W. Shang, Y. Chen, R. Wang, and C.M. Wang Effect of sodium dodecylsulfate on improving microstructural properties of electroplated silver-oxygen-tungsten thin films Surface and Coatings Technology 201 2007 9456 9461
25. C.W.M. Yuen, S.Q. Jiang, C.W. Kan, and W.S. Tung Influence of surface treatment on the electroless nickel plating of textile fabric Applied Surface Science 253 2007 5250 5257
26. F. Zhang, D. He, S. Ge, and Q. Cai Effect of fiber splitting on the catalytic graphitization of electroless Ni-B-coated polyacrylonitrile-based carbon fibers Surface and Coatings Technology 203 2008 99 103