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Volumn 53, Issue 5, 2011, Pages 1738-1747

Leaching of heavy metal elements in solder alloys

Author keywords

A. Electronic materials; A. Tin; C. Acid corrosion; C. Alkaline corrosion

Indexed keywords

A. TIN; ALKALINE CORROSION; C. ACID CORROSION; COMPONENT ELEMENTS; ELECTRONIC MATERIALS; LEACHING BEHAVIOR; METAL ELEMENTS; NACL SOLUTION; NAOH SOLUTIONS; OXYCHLORIDES; SN-3.5AG; SN-37PB; SOLDER ALLOYS; SOLDER JOINTS; SURFACE CORROSION; SURFACE OXIDE;

EID: 79952897616     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2011.01.049     Document Type: Article
Times cited : (32)

References (25)
  • 1
    • 0742334451 scopus 로고    scopus 로고
    • Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE)
    • Commission of the European Communities
    • Commission of the European Communities Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE). Off. J. Eur. Union 2003, L37:24-38.
    • (2003) Off. J. Eur. Union , vol.L37 , pp. 24-38
  • 2
    • 79952899215 scopus 로고    scopus 로고
    • European Commission-RoHS Directive, Directive 2002/95/EC of the European Parliament and of the council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronic Equipment, Brussels, Belgium, European Commission
    • European Commission-RoHS Directive, Directive 2002/95/EC of the European Parliament and of the council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronic Equipment, Brussels, Belgium, European Commission, 2003.
    • (2003)
  • 4
    • 33744526446 scopus 로고    scopus 로고
    • Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
    • Mohanty U.S., Lin K.L. Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution. Appl. Surf. Sci. 2006, 252:5907-5916.
    • (2006) Appl. Surf. Sci. , vol.252 , pp. 5907-5916
    • Mohanty, U.S.1    Lin, K.L.2
  • 6
    • 77949569170 scopus 로고    scopus 로고
    • Human health and ecological toxicity potentials due to heavy metal content in waste electronic devices with flat panel displays
    • Lim S.R., Schoenung J.M. Human health and ecological toxicity potentials due to heavy metal content in waste electronic devices with flat panel displays. J. Hazard. Mater. 2010, 177:251-259.
    • (2010) J. Hazard. Mater. , vol.177 , pp. 251-259
    • Lim, S.R.1    Schoenung, J.M.2
  • 8
    • 79952899775 scopus 로고    scopus 로고
    • Assessing exposure to lead in drinking water contaminated by corrosion of leaded solder
    • Ramsay C.N., Lyons T.D.B., Hankin S.M. Assessing exposure to lead in drinking water contaminated by corrosion of leaded solder. Epidemiology 2002, 13:624-630.
    • (2002) Epidemiology , vol.13 , pp. 624-630
    • Ramsay, C.N.1    Lyons, T.D.B.2    Hankin, S.M.3
  • 10
    • 0030615596 scopus 로고    scopus 로고
    • Lead corrosion control from lead, copper, lead solder, and brass coupons in drinking water employing free and combined chlorine
    • Hin L.N., Torrents A., Davis A.P. Lead corrosion control from lead, copper, lead solder, and brass coupons in drinking water employing free and combined chlorine. J. Environ. Sci. Health 1997, 32:865-884.
    • (1997) J. Environ. Sci. Health , vol.32 , pp. 865-884
    • Hin, L.N.1    Torrents, A.2    Davis, A.P.3
  • 11
    • 51149118865 scopus 로고    scopus 로고
    • Leaching behaviour of heavy metal elements in lead-free solders
    • Zhao J. Leaching behaviour of heavy metal elements in lead-free solders. Chin. J. Environ. Sci. 2008, 29:2341-2344.
    • (2008) Chin. J. Environ. Sci. , vol.29 , pp. 2341-2344
    • Zhao, J.1
  • 12
    • 47249086508 scopus 로고    scopus 로고
    • Leachability of printed wire boards containing leaded and lead-free solder
    • Townsend T. Leachability of printed wire boards containing leaded and lead-free solder. J. Environ. Manage. 2008, 88:926-931.
    • (2008) J. Environ. Manage. , vol.88 , pp. 926-931
    • Townsend, T.1
  • 15
    • 20344388336 scopus 로고    scopus 로고
    • Interfacial reactions between lead-free solders and common base materials
    • Laurila T., Vuorinen V., Kivilahti J.K. Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng. R 2005, 49:1-60.
    • (2005) Mater. Sci. Eng. R , vol.49 , pp. 1-60
    • Laurila, T.1    Vuorinen, V.2    Kivilahti, J.K.3
  • 17
    • 70449812932 scopus 로고    scopus 로고
    • Electrochemical Corrosion Behaviour of Sn-8Zn-3Bi-XCr Solder in 3.5% NaCl. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP),
    • J. Hu, A.M. Hu, D.L. Mao, Electrochemical Corrosion Behaviour of Sn-8Zn-3Bi-XCr Solder in 3.5% NaCl. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2009, pp. 701-707.
    • (2009) , pp. 701-707
    • Hu, J.1    Hu, A.M.2    Mao, D.L.3
  • 18
    • 40849139196 scopus 로고    scopus 로고
    • Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution
    • Li D.Z., Conway P.P., Liu C.Q. Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution. Corros. Sci. 2008, 50:995-1004.
    • (2008) Corros. Sci. , vol.50 , pp. 995-1004
    • Li, D.Z.1    Conway, P.P.2    Liu, C.Q.3
  • 19
    • 77349084832 scopus 로고    scopus 로고
    • Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder
    • Mayappan R., Ahmad Z.A. Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder. Intermetallics 2010, 18:730-735.
    • (2010) Intermetallics , vol.18 , pp. 730-735
    • Mayappan, R.1    Ahmad, Z.A.2
  • 20
    • 67349228200 scopus 로고    scopus 로고
    • Anodic behaviour of tin, indium and tin-indium alloys in oxalic acid solution
    • Mohran H.S., El-Sayed A.R., EI-Lateef H.M.A. Anodic behaviour of tin, indium and tin-indium alloys in oxalic acid solution. J. Solid State Electrochem. 2009, 13:1279-1290.
    • (2009) J. Solid State Electrochem. , vol.13 , pp. 1279-1290
    • Mohran, H.S.1    El-Sayed, A.R.2    EI-Lateef, H.M.A.3
  • 21
    • 69049106365 scopus 로고    scopus 로고
    • Generation of tin(II) oxide crystals on lead-free solder joints in deionized water
    • Chang H., Chen H.T., Li M.Y., Wang L., Fu Y.G. Generation of tin(II) oxide crystals on lead-free solder joints in deionized water. J. Elec. Materi. 2009, 38:2170-2178.
    • (2009) J. Elec. Materi. , vol.38 , pp. 2170-2178
    • Chang, H.1    Chen, H.T.2    Li, M.Y.3    Wang, L.4    Fu, Y.G.5
  • 22
    • 70349429653 scopus 로고    scopus 로고
    • Potentiodynamic studies on anodic dissolution, passivation of tin, Indium and tin-indium alloys in some fruit acids solutions
    • El-Sayed A.R., Mohran H.S., EI-Lateef H.M.A. Potentiodynamic studies on anodic dissolution, passivation of tin, Indium and tin-indium alloys in some fruit acids solutions. Corros. Sci. 2009, 51:2675-2684.
    • (2009) Corros. Sci. , vol.51 , pp. 2675-2684
    • El-Sayed, A.R.1    Mohran, H.S.2    EI-Lateef, H.M.A.3
  • 23
    • 0036532793 scopus 로고    scopus 로고
    • Corrosion of tin alloys in sulfuric and nitric acids
    • Mori M., Miura K., Sasaki T., Ohtsuka T. Corrosion of tin alloys in sulfuric and nitric acids. Corros. Sci. 2002, 44:887-898.
    • (2002) Corros. Sci. , vol.44 , pp. 887-898
    • Mori, M.1    Miura, K.2    Sasaki, T.3    Ohtsuka, T.4
  • 24
    • 51549084978 scopus 로고    scopus 로고
    • Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution
    • Mohanty U.S., Lin K.L. Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution. Corros. Sci. 2008, 50:2437-2443.
    • (2008) Corros. Sci. , vol.50 , pp. 2437-2443
    • Mohanty, U.S.1    Lin, K.L.2
  • 25
    • 77957664305 scopus 로고    scopus 로고
    • Comparison of corrosion behaviour of zinc in NaCl, in NaOH solutions. Part I: Corrosion layer characterization
    • Mouanga M., Berçot P., Rauch J.Y. Comparison of corrosion behaviour of zinc in NaCl, in NaOH solutions. Part I: Corrosion layer characterization. Corros. Sci. 2010, 50:3984-3992.
    • (2010) Corros. Sci. , vol.50 , pp. 3984-3992
    • Mouanga, M.1    Berçot, P.2    Rauch, J.Y.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.