Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Volumn , Issue , 2011, Pages

  Vollebregt, Sten ^a   Ishihara, Ryoichi ^a   Van Der Cingel, Johan ^a   Beenakker, Kees ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATED CIRCUIT; AS-GROWN; BOTTOM UP APPROACH; ELECTRICAL MEASUREMENT; FOUR-POINT PROBE; HIGH ASPECT RATIO; I - V CURVE; I-V MEASUREMENTS; LOW TEMPERATURES; METAL DEPOSITION; MONOLITHIC INTEGRATION; TOP CONTACT;

ASPECT RATIO; CARBON NANOTUBES; MONOLITHIC INTEGRATED CIRCUITS; THREE DIMENSIONAL COMPUTER GRAPHICS;

ELECTRIC PROPERTIES;

EID: 84866867150     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2012.6262989     Document Type: Conference Paper

References (15)

1. M. R. T. Mofrad, J. Derakhshandeh, R. Ishihara, A. Baiano, J. van der Cingel, and K. Beenakker, "Stacking of single-grain thin-film transistors," Japanese Journal of Applied Physics, vol. 48, p. 03B015, 2009.
2. J. Derakhshandeh, N. Golshani, R. Ishihara, M. R. T. Mofrad, M. Robertson, T. Morrison, and C. I. M. Beenakker, "Monolithic 3-D integration of SRAM and image sensor using two layers of single-grain silicon," IEEE Transactions on Electron Devices, vol. 58, no. 11, pp. 3954-3961, 2011.
3. D. Mann, A. Javey, J. Kong, Q. Wang, and H. Dai, "Ballistic transport in metallic nanotubes with reliable Pd ohmic contacts," Nano Letters, vol. 3, no. 11, pp. 1541-1544, 2003.
4. H. J. Li, W. G. Lu, J. J. Li, X. D. Bai, and C. Z. Gu, "Multichannel ballistic transport in multiwall carbon nanotubes," Physical Review Letters, vol. 95, p. 086601, 2005.
5. B. Q. Wei, R. Vajtai, and P. M. Ajayan, "Reliability and current carrying capacity of carbon nanotubes," Applied Physics Letters, vol. 79, no. 8, pp. 1172-1174, 2001.
6. E. Pop, D. Mann, Q. Wang, K. Goodson, and H. Dai, "Thermal conductance of an individual single-wall carbon nanotube above room temperature," Nano Letters, vol. 6, no. 1, pp. 96-100, 2006.
7. J. Dijon, H. Okuno, M. Fayolle, T. Vo, J. Pontcharra, D. Acquaviva, D. Bouvet, A. M. Ionescu, C. S. Esconjauregui, B. Capraro, E. Quesnel, and J. Robertson, "Ultra-high density carbon nanotubes on Al-Cu for advanced vias," in International Electron Devices Meeting, 2010, p. 33.4.1.
8. D. Yokoyama, T. Iwasaki, K. Ishimaru, S. Sato, T. Hyakushima, M. Nihei, Y. Awano, and H. Kawarada, "Electrical properties of carbon nanotubes grown at a low temperature for use as interconnects," Japanese Journal of Applied Physics, vol. 47, no. 4, pp. 1985-1990, 2008.
9. Y.-M. Choi, S. Lee, H. S. Yoon, M.-S. Lee, H. Kim, I. Han, Y. Son, I.-S. Yeo, U.-I. Chung, and J.-T. Moon, "Integration and electrical properties of carbon nanotube array for interconnect applications," in Nanotechnology, 2006. IEEE-NANO 2006. Sixth IEEE Conference on, 2006, pp. 262-265.
10. F. Kreupl, A. P. Graham, G. S. Duesberg, W. Steinhögl, M. Liebau, E. Unger, and W. Hönlein, "Carbon nanotubes in interconnect applications," Microelectron. Eng., vol. 64, pp. 399-408, 2002.
11. J. Li, Q. Ye, A. Cassell, H. T. Ng, R. Stevens, J. Han, and M. Meyyappan, "Bottom-up approach for carbon nanotube interconnects," Applied Physics Letters, vol. 82, no. 15, pp. 2491-2493, 2003.
12. S. Vollebregt, R. Ishihara, J. Derakhshandeh, J. van der Cingel, H. Schellevis, and C. Beenakker, "Integrating low temperature aligned carbon nanotubes as vertical interconnects in si technology," in Nanotechnology, 2011. IEEE-NANO 2011. 11th IEEE Conference on, 2011, pp. 985-990.
13. H.-C. Su, C.-H. Chen, Y.-C. Chen, D.-J. Yao, H. Chen, Y.-C. Chang, and T.-R. Yew, "Improving the adhesion of carbon nanotubes to a substrate using microwave treatment," Carbon, vol. 48, pp. 805-812, 2010.
14. N. Chiodarelli, "Integration of carbon nanotubes as future interconnections for sub-32nm technologies," Ph.D. dissertation, Katholieke Universiteit Leuven, 2011.
15. D. N. Futaba, K. Hata, T. Yamada, T. Hiraoka, Y. Hayamizu, Y. Kakudate, O. Tanaike, H. Hatori, M. Yumura, and S. Iijima, "Shape-engineerable and highly densely packed single-walled carbon nanotubes and their application as super-capacitor electrodes," Nature Materials, vol. 5, pp. 987-994, 2006.