Thermal performance characterization of nano thermal interface materials after power cycling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 1426-1430

  Sun, Shuangxi ^a   Xin, Luo ^a,b   Zandén, Carl ^b   Carlberg, Björn ^b   Ye, Lilei ^c   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENT SIZES; DISSIPATION EFFECTS; ELECTRONIC PACKAGING; HEAT FLOW PATH; IN-CHIP; JUNCTION TEMPERATURES; MICROELECTRONIC COMPONENTS; NANO-STRUCTURED; POLYMER-METAL COMPOSITE; POWER CYCLING; POWER EFFECTS; SEMICONDUCTOR PROCESSING; THERMAL INTERFACE MATERIALS; THERMAL PERFORMANCE; TRANSIENT THERMAL RESISTANCE; X RAY SCANNING;

COMPOSITE FILMS; ELASTICITY; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; HEAT RESISTANCE; MICROELECTRONICS; THERMAL INSULATING MATERIALS;

INTERFACES (MATERIALS);

EID: 84866845260     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6249023     Document Type: Conference Paper

References (16)

1. ITRS, "International Technology Roadmap for Semiconductors 2007 Edition - Assembly and Packaging," 2007.
2. R. Mahajan, C.-P. Chiu, and G. Chrysler, "Cooling a Microprocessor Chip," Proceedings of the IEEE, vol. 94, no. 8 (2006), pp. 1476-1486.
3. R. Prasher, "Thermal interface materials: Historical perspective, status, and future directions," Proceedings of the IEEE, vol. 94, no. 8 (2006), pp. 1571-1586.
4. H. Huang, C. Liu, Y. Wu, and S. Fan, "Aligned Carbon Nanotube Composite Films for Thermal Management," Advanced Materials, vol. 17, no. 13 (2005), pp. 1652-1656.
5. B. Cola, S. Hodson, X. Xu, and T. Fisher, "Carbon nanotube array thermal interfaces enhanced with paraffin wax," 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008, 2009, pp. 765-770.
6. E.S. Choi, J.S. Brooks, D.L. Eaton, M.S. Al-Haik, M.Y. Hussaini, H. Garmestani, D. Li, and K. Dahmen, "Enhancement of thermal and electrical properties of carbon nanotube polymer composites by magnetic field processing," Journal of Applied Physics, vol. 94, no. 9 (2003), pp. 6034-6039.
7. J. Xu, A. Munari, E. Dalton, A. Mathewson, and K. Razeeb, "Silver nanowire array-polymer composite as thermal interface material," Journal of Applied Physics, vol. 106, no. 12 (2009), pp. 124310.
8. Bjo{combining double grave accent}rn Carlberg, Johan Liu and Li Lei Ye, "Ploymer Nanofiber Based Continuous Metal Phase Composite for Thermal Management Applications," Proceeding 3r Electronic System-tegration Technology Conference (ESTC2010), Berlin, Germany, September 13-16. 2010, pp. 1-6.
9. Yifeng Fu, Teng Wang, Ove Jonsson, and Johan Liu, "Application of through silicon via technology for in situ temperature monitoring on thermal interfaces," Journal of Micromechanics And Microengineering,vol. 20, no. 2 (2010), pp. 025-027.
10. J.R. Davis, Ed., Metals Handbook, Materials Park, OH, USA: ASM International, 1998.
11. H. H. Kim, S. H. Choi, S. H. Shin et al. "Thermal transient characteristics of die attach in high power LED PKG," Journal of Microelectronics Reliability, vol. 48, no. 3 (2008), pp. 445-454.
12. G. Farkas, S. Haque, F. Wall et al. "Electric and thermal transient effects in high power optical devices," Semiconductor Thermal Measurement and Management Symposium Conf, San Jose, CA, USA, Mar. 2004, pp. 168-176.
13. A. Poppe, G. Farkas, G. Horváth. "Electrical, Thermal and Optical Characterization of Power LED Assemblies," International Workshop on Thermal investigations of ICs Conf , Nice, Côte d'Azur, France, Sep. 2006, pp. 27-29.
14. P. Szabó, M. Rencz, G. Farkas et al. "Short Time Die Attach Characterization of Leds for In-line Testing Application," Electronics Packaging Technology Conference Conf, Singapore, Dec. 2006, pp. 360-366.
15. A. Poppe, Y. Zhang, J. Wilson et al. "Thermal Measurement and Modeling of Multi-Die Packages," IEEE Transactions on components and packaging technologies, vol. 32, no. 2, (2009), pp. 484-492.
16. W. J. Hwang, T. H. Lee, J. H. Choi et al. "Thermal Investigation of GaN-Based Laser Diode Package," IEEE Transactions on components and packaging technologies", vol. 30, no. 4 (2007), pp. 637-642.