Hardness of silicon nitride thin films characterised by nanoindentation and nanoscratch deconvolution methods

Materials Science and Technology (United Kingdom)

Volumn 28, Issue 9-10, 2012, Pages 1172-1176

  Liu, S ^a   Huang, H ^a   Gu, Y T ^b  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b QUEENSLAND UNIVERSITY OF TECHNOLOGY   (Australia)

Author keywords

Hardness; Nanoindentation; Nanoscratch; Thin film

Indexed keywords

ACCURATE MEASUREMENT; DECONVOLUTION METHOD; DEPOSITION CONDITIONS; HARDNESS VALUES; MEASURED RESULTS; NANO-SCRATCH; NANOMETRIC SCALE; PLASMA ENHANCED CHEMICAL VAPOUR DEPOSITION; SILICON NITRIDE FILM; SILICON NITRIDE THIN FILMS; SILICON SUBSTRATES;

DEPOSITION; ELECTROMECHANICAL DEVICES; LOADING; MEMS; NANOINDENTATION; NANOTECHNOLOGY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON NITRIDE; THIN FILMS; VAPOR DEPOSITION;

HARDNESS;

EID: 84866053318     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/1743284712Y.0000000005     Document Type: Conference Paper

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