Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper

Journal of Adhesion Science and Technology

Volumn 26, Issue 18-19, 2012, Pages 2301-2314

  Schaubroeck, David ^a   Van Den Eeckhout, Emilie ^a   De Baets, Johan ^a   Dubruel, Peter ^b   Van Vaeck, Luc ^c   Van Calster, André ^a  

^a GHENT UNIVERSITY   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

^c UNIVERSITY OF ANTWERP   (Belgium)

Author keywords

adhesion; electroless copper; epoxy resin; Polydopamine; surface modification

Indexed keywords

ELECTROLESS; ELECTROLESS COPPER; EPOXY RESIN SUBSTRATE; PHOTO-DEFINABLE; PLATING BATH TEMPERATURE; POLYDOPAMINE;

BOND STRENGTH (MATERIALS); CHEMICAL MODIFICATION; COPPER; ELECTROLESS PLATING; ELECTROPLATING; EPOXY RESINS; RESINS; SURFACE TREATMENT;

ADHESION;

EID: 84865489373     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856111X623104     Document Type: Article

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