Experimental investigation of silicon-based oblique finned microchannel heat sinks

2010 14th International Heat Transfer Conference, IHTC 14

Volumn 6, Issue , 2010, Pages 283-291

  Lee, Yong Jiun ^a   Lee, Poh Seng ^a   Chou, Siaw Kiang ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Electronic cooling; Enhanced microchannel; Oblique fins; Thermal management

Indexed keywords

CHIP TEMPERATURE; CONVECTIVE HEAT TRANSFER; ENHANCEMENT TECHNIQUES; ENTRANCE EFFECTS; EXPERIMENTAL INVESTIGATIONS; FLUID MIXING; HEAT TRANSFER ENHANCEMENT; HEAT TRANSFER PERFORMANCE; LEADING EDGE; MICRO CHANNEL HEAT SINKS; OBLIQUE FINS; REINITIALIZATION; SILICON MICROCHANNEL HEAT SINKS; SILICON-BASED; THERMAL BOUNDARY LAYER; WORKING FLUID;

BOUNDARY LAYERS; ELECTRONIC COOLING; FORCED CONVECTION; MICROCHANNELS; NUSSELT NUMBER; TEMPERATURE CONTROL;

FINS (HEAT EXCHANGE);

EID: 84860510972     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IHTC14-23413     Document Type: Conference Paper

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