Experimental investigation of oblique finned microchannel heat sink +

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Lee, Yong Jiun ^a   Lee, Poh Seng ^a   Chou, Siaw Kiang ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Electronic cooling; Enhanced microchannel; Oblique fins; Thermal management

Indexed keywords

BASE TEMPERATURE; CONVECTIVE HEAT TRANSFER; COPPER-BASED; ELECTRONIC COOLING; ENHANCEMENT TECHNIQUES; ENTRANCE EFFECTS; EXPERIMENTAL INVESTIGATIONS; FLUID MIXING; FLUID TEMPERATURES; HEAT TRANSFER ENHANCEMENT; HEAT TRANSFER PERFORMANCE; LEADING EDGE; MICRO CHANNEL HEAT SINKS; THERMAL BOUNDARY LAYER; THERMAL MANAGEMENT; THERMAL RESISTANCE; WORKING FLUID;

BOUNDARY LAYERS; ELECTRONICS ENGINEERING; FINS (HEAT EXCHANGE); FLUIDS; FORCED CONVECTION; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT TRANSFER; SECONDARY FLOW; TEMPERATURE CONTROL; VEHICULAR TUNNELS;

MICROCHANNELS;

EID: 77955225282     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501362     Document Type: Conference Paper

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