In situ ultra-high vacuum transmission electron microscopy studies of the transient oxidation stage of Cu and Cu alloy thin films

Micron

Volumn 43, Issue 11, 2012, Pages 1195-1210

  Yang, Judith C ^a   Zhou, Guangwen ^b  

^a University of Pittsburgh   (United States)

^b State University of New York   (United States)

Author keywords

Cu; Cu Au; Cu Ni; In situ; Oxidation; TEM

Indexed keywords

CU ALLOY; CU-AU; CU-NI; ENGINEERED MATERIALS; ENVIRONMENTAL STABILITY; EXPERIMENTAL PROCEDURE; HETEROEPITAXIAL; IN-SITU; INITIAL OXIDATION; INTERFACIAL STRAIN; METAL SYSTEMS; OXIDATION BEHAVIORS; OXIDATION MECHANISMS; OXYGEN PRESSURE; STRUCTURAL CHANGE; SUBSTRATE MATERIAL; SURFACE CONDITIONS; SYSTEMATIC STUDY; THIN FILM FORMATION; TRANSIENT OXIDATIONS;

CHEMISORPTION; COPPER; EPITAXIAL GROWTH; FILM GROWTH; GERMANIUM; OXIDATION; OXYGEN; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; VACUUM TECHNOLOGY;

COPPER ALLOYS;

EID: 84864807962     PISSN: 09684328     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.micron.2012.02.007     Document Type: Article

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