3D integration of ultra-thin functional devices inside standard multilayer flex laminates

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Christiaens, W ^a   Torfs, T ^a   Huwel, W ^a   Van Hoof, C ^a   Vanfleteren, J ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

3D integration; Chip package; Flex; Ultra thin chip

Indexed keywords

3-D INTEGRATION; ACTIVE COMPONENTS; ACTIVE DEVICES; CHIP PACKAGES; DOUBLE SIDED; FAN-OUT; FLEX- BOARD; FLEXIBLE SUBSTRATE; FUNCTIONAL DEVICES; IN-BETWEEN; INTEGRATED DEVICE; LIMITING FACTORS; LOW-POWER MICROCONTROLLERS; MECHANICAL FLEXIBILITY; METALLIZATIONS; MULTILAYER STACKS; RIGID COMPONENTS; TEXAS INSTRUMENTS; THROUGH HOLE; ULTRA-THIN; ULTRA-THIN CHIPS; WEARABLE ELECTRONICS; WEARABLE SYSTEMS;

CONTROLLERS; DIGITAL TO ANALOG CONVERSION; ECONOMIC ANALYSIS; INTEGRATION; LAMINATING; MICROCONTROLLERS; MICROELECTRONICS; MULTILAYERS; PACKAGING; PAPER LAMINATES; SUBSTRATES; THREE DIMENSIONAL; WEARABLE COMPUTERS;

CHIP SCALE PACKAGES;

EID: 70449839141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. W. Christiaens, B. Vandevelde, E. Bosman, and J. Vanfleteren, "UTCP: 60 mm thick bendable chip package", Proceedings of IWLPS, San Jose, November 1-3, pp. 114-119, 2006.