Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 1, 2010, Pages 72-78

  Govaerts, Jonathan ^a,b   Bosman, Erwin ^a,b   Christiaens, Wim ^a,b   Vanfleteren, Jan ^a,b  

^a IMEC   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

Author keywords

Chip embedding; Fine pitch interconnection; Flexible polyimide substrates; Thin chip packaging

Indexed keywords

FABRICATION PROCESS; FINE-PITCH CAPABILITY; FLEXIBLE POLYIMIDE; FLEXIBLE POLYIMIDE SUBSTRATE; FLEXIBLE SUBSTRATE; FOUR-POINT PROBE; RIGID COMPONENTS; TEST CHIPS; THIN CHIPS; ULTRA-THIN CHIPS;

FLEXIBLE ELECTRONICS; PACKAGING; POLYIMIDES; SUBSTRATES; TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 77949273948     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2018134     Document Type: Article

References (6)

1. W. Christiaens, B. Vandevelde, E. Bosman, and J. Vanfleteren, "UTCP 60 μm thick bendable chip package," presented at the Proc. IWLPS, San Jose, CA, Nov. 2006.
2. J. Govaerts, W. Christiaens, E. Bosman, and J. Vanfleteren, "Fabrication processes for embedding thin chips in flat flexible substrates," IEEE Trans. Adv. Packag., vol. 32, no. 1, pp. 77-83, Feb. 2009.
3. J. Govaerts, W. Christiaens, E. Bosman, and J. Vanfleteren, "Multiple chip integration for flat flexible electronics," in Proc. 7th IEEE Conf. Polymers Adhesives Microelectron. Photonics (Polytronic 2008), Aug. 2008, pp. 1-7.
4. E. I. Haskal, I. D. French, H. Lifka, R. Sanders, P. Bouten, T. Kretz, E. Chuiton, G. Gomez, F. Mazel, C. Prat, F. Templier, M. D. Campo, and F. Stahr, "Flexible OLED displays made with the EPLaR process," in Proc. EURODISPLAY 2007, Sep. 2007, pp. 36-39.
5. Finetech, e.g., Press Release on Fineplacer FEMTO Assembly & Packaging SMT 2008, 2008 [Online]. Available: http://www.finetech.de
6. J. Govaerts and J. Vanfleteren, "Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays," in Proc. 2nd Electron. Syst.-Integration Technol. Conf., Sep. 2008, pp. 309-314.