Impact of thermal cycling in humid environments on power electronic modules

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 7, 2012, Pages 1085-1091

  Wang, Ningyan ^a   Cotton, Ian ^b   Evans, Kim ^c  

^a Fujian Electric Power Company Ltd   (China)

^b UNIVERSITY OF MANCHESTER   (United Kingdom)

^c DYNEX SEMICONDUCTOR LTD   (United Kingdom)

Author keywords

Finite element methods; humidity; partial discharges; power electronics; silicone insulation

Indexed keywords

CRITICAL LOCATION; DIELECTRIC SYSTEMS; HIGH ELECTRIC FIELDS; HIGH VOLTAGE; HUMID ENVIRONMENT; POWER DENSITIES; POWER ELECTRONIC MODULES; RELIABLE OPERATION; SILICONE INSULATIONS;

ATMOSPHERIC HUMIDITY; ELECTRIC FIELDS; FINITE ELEMENT METHOD; METALLIZING; PARTIAL DISCHARGES; POWER ELECTRONICS; SILICONES;

INTERFACES (MATERIALS);

EID: 84863774616     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2195781     Document Type: Article

References (14)

1. T. Ruemenapp and D. Peier, "Investigation of the ageing performance of AlN-ceramic used in high-power-semiconductors," in Proc. 8th Int. Conf. Dielectric Mater., Meas. Appl., Sep. 2000, pp. 285-290. (Pubitemid 32024306)
2. Railway Applications-Power Convertors Installed on Board Rolling Stock, Standard IEC61287, 2005.
3. F. Breit, E. Dutarde, J. Saiz, T. Lebey, D. Malec, and S. Dinculescu, "Partial discharge detection in power modules," in Proc. IEEE 33rd Annu. Power Electron. Special. Conf., vol. 2. Nov. 2002, pp. 748-752. (Pubitemid 35411139)
4. T. Ebke, A. Khaddour, and D. Peier, "Degradation of silicone gel by partial discharges due to different defects," in Proc. 8th Int. Conf. Dielectric Mater., Meas. Appl., Edinburgh, U. K. , Sep. 2000, pp. 202-207. (Pubitemid 32024291)
5. G. Finis and A. Claudi, "Silicone gel as an insulation material for HV-insulation applications," in Proc. 14th Int. Symp. High Voltage Eng., 2005, pp. 1-5.
6. J. H. Fabian, S. Hartmann, and A. Hamidi, "Analysis of insulation failure modes in high power IGBT modules," in Proc. 14th Annu. Meeting Ind. Appl. Conf., vol. 2. Oct. 2005, pp. 799-805. (Pubitemid 44042540)
7. G. Mitic, T. Licht, and G. Lefranc, "IGBT module technology with high partial discharge resistance," in Proc. 36th Annu. Meeting Ind. Appl. Conf., vol. 3. Chicago, IL, 2001, pp. 1899-1904. (Pubitemid 33058596)
8. T. Lebey, S. Dinculescu, and D. Malec, "Partial discharges testing of power modules," in Proc. Int. Conf. Solid Dielectr., vol. 2. Jul. 2004, pp. 896-899.
9. M. T. Do, J. L. Auge, and O. Lesaint, "Optical measurement of partial discharges in silicone gel under repetitive pulse voltage," in Proc. Int. Symp. Electr. Insul. Mater., vol. 2. Kitakyushu, Japan, Jun. 2005, pp. 360-363. (Pubitemid 41382210)
10. T. A. T. Vu, J. L. Auge, and O. Lesaint, "Low temperature partial discharge properties of silicone gels used to encapsulate power semiconductors," in Proc. IEEE Conf. Electr. Insul. Dielectr. Phenomena, Virginia Beach, VA, Oct. 2009, pp. 421-424.
11. S. Catellani, J. C. Crebier, C. Schaeffer, and T. Marsala, "Thermal and electrical ageing of DBC substrates," in Proc. IEEE 32nd Annu. Power Electron. Special. Conf., vol. 4. Jun. 2001, pp. 1955-1960. (Pubitemid 32950510)
12. High Isolation Single Switch IGBT Module, Dynex Semiconductor, Lincoln, U. K. , 2005.
13. G. Finis and A. Claudi, "Silicone gel as an insulation material for HV-insulation applications," in Proc. 14th Int. Symp. High Voltage Eng., 2005, pp. 1-5.
14. G. Finis and A. Claudi, "On the electric breakdown behavior of silicone gel at interfaces," IEEE Trans. Dielectr. Electr. Insul., vol. 15, no. 2, pp. 366-373, Apr. 2008. (Pubitemid 351540646)