Low temperature partial discharge properties of silicone gels used to encapsulate power semiconductors

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

Volumn , Issue , 2009, Pages 421-424

  Vu, T A T ^a   Auge J L ^a   Lesaint, O ^a  

^a UNIV GRENOBLE ALPES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AIRCRAFT ELECTRICAL SYSTEM; ALN; AMBIENT TEMPERATURES; EXTREME TEMPERATURES; INCEPTION VOLTAGES; LOW TEMPERATURES; POWER ELECTRONICS MODULES; POWER SEMICONDUCTORS; SHORT DURATIONS; SILICONE GELS; SMALL AMPLITUDE; THERMO-MECHANICAL STRESS;

ACTIVE FILTERS; ELECTRIC MACHINE INSULATION; PARTIAL DISCHARGES; POWER ELECTRONICS; SILICONES; STRESSES;

GELS;

EID: 77949301379     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2009.5377750     Document Type: Conference Paper

References (9)

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