Thermal and electrical ageing of DBC substrates

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 4, Issue , 2001, Pages 1955-1960

  Catellani, S ^a   Crebier J C ^a   Schaeffer, C ^a   Marsala, T ^a  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC FIELD EFFECTS; LEAKAGE CURRENTS; SUBSTRATES; THERMAL CYCLING; THERMAL EFFECTS;

ELECTRICAL AGING; THERMAL AGING;

POWER ELECTRONICS;

EID: 0034795469     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Localisation of electrical-insulation- and partial-discharge failures of IGBT modules
2. Investigation of the ageing performance of AlN-ceramic used in high-power-semiconductors
3. Diélectriques. Courants de conduction
4. Development of a Stacked-Plate Technique for 3-D Packaging of Power Electronics Modules
5. Phonon excitations and related thermal properties of aluminium nitride
6. A novel approach to high current hermetic packaging