Exploiting die-to-die thermal coupling in 3D IC placement

Proceedings - Design Automation Conference

Volumn , Issue , 2012, Pages 741-746

  Athikulwongse, Krit ^a   Pathak, Mohit ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3D IC; temperature; TSV

Indexed keywords

FORCE-DIRECTED; HIGH-POWER; LOCAL POWER DENSITIES; LOGIC CELLS; THERMAL COUPLING; TSV; VERTICALLY ALIGNED;

COMPUTER AIDED DESIGN; HEAT SINKS; LOGIC DEVICES; TEMPERATURE; THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

DIES;

EID: 84863541923     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/2228360.2228495     Document Type: Conference Paper

References (7)

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