-
1
-
-
34047254077
-
A perspective on today's scaling challenges and possible future directions
-
DOI 10.1016/j.sse.2007.02.004, PII S0038110107000500
-
R. H. Dennard, J. Cai, and A. Kumar, "A perspective on today's scaling challenges and possible future directions," Solid State Electron., vol. 51, no. 4, pp. 518-525, Apr. 2007. (Pubitemid 46550572)
-
(2007)
Solid-State Electronics
, vol.51
, Issue.4 SPEC. ISS.
, pp. 518-525
-
-
Dennard, R.H.1
Cai, J.2
Kumar, A.3
-
2
-
-
77950067825
-
4-terminal relay technology for complementary logic
-
R. Nathanael, V. Pott, H. Kam, J. Jeon, and T.-J. King Liu, "4-terminal relay technology for complementary logic," in IEDM Tech. Dig., 2009, pp. 223-226.
-
(2009)
IEDM Tech. Dig.
, pp. 223-226
-
-
Nathanael, R.1
Pott, V.2
Kam, H.3
Jeon, J.4
King Liu, T.-J.5
-
3
-
-
77952779203
-
Demonstration of low voltage and functionally complete logic operations using body-biased complimentary and ultra-thin AlN piezoelectric mechanical switches
-
N. Sinha, T. Jones, Z. Guo, and G. Piazza, "Demonstration of low voltage and functionally complete logic operations using body-biased complimentary and ultra-thin AlN piezoelectric mechanical switches," in Proc. MEMS, 2010, pp. 751-754.
-
(2010)
Proc. MEMS
, pp. 751-754
-
-
Sinha, N.1
Jones, T.2
Guo, Z.3
Piazza, G.4
-
4
-
-
77951880158
-
Demonstration of integrated micro-electro-mechanical (MEM) switch circuits for VLSI applications
-
F. Chen, M. Spencer, R. Nathanael, C. Wang, H. Fariborzi, A. Gupta, H. Kam, V. Pott, J. Jeon, T.-J. King Liu, D. Markovi, V. Stojanovi, and E. Alon, "Demonstration of integrated micro-electro-mechanical (MEM) switch circuits for VLSI applications," in IEEE Int. Solid-State Circuits Conf. Tech. Dig., 2010, pp. 150-151.
-
(2010)
IEEE Int. Solid-State Circuits Conf. Tech. Dig.
, pp. 150-151
-
-
Chen, F.1
Spencer, M.2
Nathanael, R.3
Wang, C.4
Fariborzi, H.5
Gupta, A.6
Kam, H.7
Pott, V.8
Jeon, J.9
King Liu, T.-J.10
Markovi, D.11
Stojanovi, V.12
Alon, E.13
-
5
-
-
57849141612
-
Integrated circuit design with NEM relays
-
F. Chen, H. Kam, D. Markovi, T.-J. King Liu, V. Stojanovi, and E. Alon, "Integrated circuit design with NEM relays," in Proc. IEEE/ACM Int. Conf. Comput.-Aided Des., 2008, pp. 750-757.
-
(2008)
Proc. IEEE/ACM Int. Conf. Comput.-Aided Des.
, pp. 750-757
-
-
Chen, F.1
Kam, H.2
Markovi, D.3
King Liu, T.-J.4
Stojanovi, V.5
Alon, E.6
-
6
-
-
77952415045
-
Design and reliability of a micro-relay technology for zero-standby-power digital logic applications
-
H. Kam, V. Pott, R. Nathanael, J. Jeon, E. Alon, and T.-J. K. Liu, "Design and reliability of a micro-relay technology for zero-standby-power digital logic applications," in IEDM Tech. Dig., 2009, pp. 809-811.
-
(2009)
IEDM Tech. Dig.
, pp. 809-811
-
-
Kam, H.1
Pott, V.2
Nathanael, R.3
Jeon, J.4
Alon, E.5
Liu, T.-J.K.6
-
7
-
-
34247379448
-
Metal contact reliability of RF MEMS switches
-
Q. Ma, Q. Tran, T.-K. A. Chou, J. Heck, H. Bar, R. Kant, and V. Rao, "Metal contact reliability of RF MEMS switches," Proc. SPIE, vol. 6463, p. 646 305, 2007.
-
(2007)
Proc. SPIE
, vol.6463
, pp. 646305
-
-
Ma, Q.1
Tran, Q.2
Chou, T.-K.A.3
Heck, J.4
Bar, H.5
Kant, R.6
Rao, V.7
-
8
-
-
1642621158
-
General relationship for the thermal oxidation of silicon
-
Dec.
-
B. E. Deal and A. S. Grove, "General relationship for the thermal oxidation of silicon," J. Appl. Phys., vol. 36, no. 12, pp. 3770-3778, Dec. 1965.
-
(1965)
J. Appl. Phys.
, vol.36
, Issue.12
, pp. 3770-3778
-
-
Deal, B.E.1
Grove, A.S.2
-
9
-
-
27644531339
-
Effect of nanoscale heating on electrical transport in RF MEMS switch contacts
-
DOI 10.1109/JMEMS.2005.856653
-
B. D. Jensen, L. L. W. Chow, K. Huang, K. Saitou, J. L. Volakis, and K. Kurabayashi, "Effect of nanoscale heating on electrical transport in RF MEMS switch contacts," J. Microelectromech. Syst., vol. 14, no. 5, pp. 935-946, Oct. 2005. (Pubitemid 41555285)
-
(2005)
Journal of Microelectromechanical Systems
, vol.14
, Issue.5
, pp. 935-946
-
-
Jensen, B.D.1
Chow, L.L.-W.2
Huang, K.3
Saitou, K.4
Volakis, J.L.5
Kurabayashi, K.6
-
10
-
-
78650907088
-
Demonstration of integrated micro-electro-mechanical relay circuits for VLSI applications
-
Jan.
-
M. Spencer, F. Chen, C. Wang, R. Nathanael, H. Fariborzi, A. Gupta, H. Kam, V. Pott, J. Jeon, T.-J. King Liu, D. Markovic, E. Alon, and V. Stojanovic, "Demonstration of integrated micro-electro-mechanical relay circuits for VLSI applications," IEEE J. Solid-State Circuits, vol. 46, no. 1, pp. 308-320, Jan. 2011.
-
(2011)
IEEE J. Solid-State Circuits
, vol.46
, Issue.1
, pp. 308-320
-
-
Spencer, M.1
Chen, F.2
Wang, C.3
Nathanael, R.4
Fariborzi, H.5
Gupta, A.6
Kam, H.7
Pott, V.8
Jeon, J.9
King Liu, T.-J.10
Markovic, D.11
Alon, E.12
Stojanovic, V.13
-
11
-
-
0142165226
-
Single wafer encapsulation of MEMS devices
-
Aug.
-
R. Candler, W. Park, H. Li, G. Yama, A. Partridge, M. Lutz, and T. Kenny, "Single wafer encapsulation of MEMS devices," IEEE Trans. Adv. Packag., vol. 26, no. 3, pp. 227-232, Aug. 2003.
-
(2003)
IEEE Trans. Adv. Packag.
, vol.26
, Issue.3
, pp. 227-232
-
-
Candler, R.1
Park, W.2
Li, H.3
Yama, G.4
Partridge, A.5
Lutz, M.6
Kenny, T.7
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