Modification of epoxy resin with cycloaliphatic-epoxy oligosiloxane for Light-Emitting Diode (LED) encapsulation application

Journal of Macromolecular Science, Part B: Physics

Volumn 51, Issue 8, 2012, Pages 1509-1524

  Gao, Nan ^a,b   Liu, Wei Qu ^a   Ma, Song Qi ^a,b   Yan, Zhen Long ^a,b   Zhao, Yuan ^a,b  

^a GUANGZHOU INSTITUTE OF CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

cycloaliphatic epoxy resin; encapsulant; light emitting diode (LED); modification; oligosiloxane; properties

Indexed keywords

CYCLOALIPHATIC EPOXY RESINS; ENCAPSULANTS; MODIFICATION; OLIGOSILOXANE; PROPERTIES;

CONDENSATION REACTIONS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIODES; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GEL PERMEATION CHROMATOGRAPHY; HYDROLYSIS; IMPACT TESTING; MECHANICAL PROPERTIES; MOLECULAR WEIGHT DISTRIBUTION; RESINS; SCANNING ELECTRON MICROSCOPY; SILICON; THERMOGRAVIMETRIC ANALYSIS;

LIGHT EMITTING DIODES;

EID: 84862705244     PISSN: 00222348     EISSN: 1525609X     Source Type: Journal    
DOI: 10.1080/00222348.2012.655960     Document Type: Article

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