Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes

Journal of Applied Polymer Science

Volumn 100, Issue 2, 2006, Pages 1048-1056

  Kumar, R N ^a   Keem, Lim Yoke ^b   Mang, Ng Chee ^c   Abubakar, Abusamah ^a  

^a Universiti Sains Malaysia   (Malaysia)

^b Agilent Technologies   (Malaysia)

^c Permatang Tinggi Industrial Estate   (Malaysia)

Author keywords

Cationic photoinitiators; Epoxy resins; Light emitting diodes; Ultraviolet radiation curing

Indexed keywords

CURING; DURABILITY; LIGHT EMITTING DIODES; POSITIVE IONS; ULTRAVIOLET RADIATION; VISCOELASTICITY;

CATIONIC PHOTOINITIATORS; SOLDERABILITY; ULTRAVIOLET RADIATION CURING;

EPOXY RESINS;

CURING; DURABILITY; EPOXY RESIN; ULTRAVIOLET RADIATION; VISCOELASTICITY;

EID: 33645154887     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.23189     Document Type: Article

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