Mechanical and thermal properties and morphology of epoxy resins modified by a silicon compound

Journal of Macromolecular Science, Part A: Pure and Applied Chemistry

Volumn 47, Issue 11, 2010, Pages 1084-1090

  Ma, Songqi ^a,b   Liu, Weiqu ^a   Wei, Zhengjie ^a,b   Li, Hongjing ^a,b  

^a GUANGZHOU INSTITUTE OF CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Epoxy; mechanical properties; morphology; silicon; sol gel; thermal property

Indexed keywords

CHEMICAL STRUCTURE; CURED EPOXY RESINS; CURING PROCESS; DIGLYCIDYL ETHER OF BISPHENOL-A; ENVIRONMENTAL SCANNING ELECTRON MICROSCOPY; EPOXY; FRACTURE SURFACES; GLASS TRANSITION TEMPERATURE; MECHANICAL AND THERMAL PROPERTIES; THERMAL PROPERTIES;

CRACK TIPS; CROSSLINKING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ETHERS; FUNCTIONAL GROUPS; GELS; GLASS; GLASS TRANSITION; HYBRID MATERIALS; IMPACT STRENGTH; IMPACT TESTING; MECHANICAL PROPERTIES; MORPHOLOGY; PHENOLS; RESINS; SCANNING ELECTRON MICROSCOPY; SILICON COMPOUNDS; SOL-GEL PROCESS; SOL-GELS; SOLS; TEMPERATURE; TENSILE STRENGTH; TENSILE TESTING;

EPOXY RESINS;

EID: 77957131528     PISSN: 10601325     EISSN: 15205738     Source Type: Journal    
DOI: 10.1080/10601325.2010.511522     Document Type: Article

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